SEMI International Standards
Standards Locale: North America
Committee: 3D Packaging and Integration
Place of Meeting: SEMI Headquarters, Milpitas, CA
Date of Meeting: 04/10/2018
Meeting End Date: 04/10/2018
Recording SEMI Standards Staff: Laura Nguyen
CER Posted to Web: 04/27/2018


Leadership Changes
None.

Committee Structure Changes
None.

Ballot Results
None.

Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting

#
Type
SC/TF/WG
Details
6332SNARFFO-PLP Panel TFNew Standard, Specification for Panel Substrate Characteristics for Fan-Out Panel Level Packaging (FO-PLP) Applications
– TC Member Review took place between 12/20/2017 and 01/03/2018 before approval by GCS on 01/11/2018


Authorized Activities
Listing of all revised or new SNARF(s) approved by the Originating TC Chapter.
#
Type
SC/TF/WG
Details
6332SNARFFO-PLP Panel TFNew Standard, Specification for Panel Substrate Characteristics for Fan-Out Panel Level Packaging (FO-PLP) Applications
– TC Member Review took place between 12/20/2017 and 01/03/2018 before approval by GCS on 01/11/2018
6075SNARF3DP&I Bonded Wafer StacksNew Standard, Guide for Describing Glass and Quartz Based Material for Use in 3DS-IC Process
– Revision to SNARF title and scope. TC Member Review took place between 03/13/2018 and 03/26/2018
6389SNARFNA 3DP&I CommitteeReapproval of SEMI 3D3-0613, Guide for Multiwafer Transport and Storage Containers for 300 mm, Thin Silicon Wafers on Tape Frames
6390SNARFNA 3DP&I CommitteeReapproval of SEMI 3D5-0314, Guide for Metrology Techniques to be Used in Measurement of Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures
Note 1: SNARFs and TFOFs are available for review on the SEMI Web site at:

http://downloads.semi.org/web/wstdsbal.nsf/TFOFSNARF

Authorized Ballots
Listing of documents authorized by the Originating TC Chapter for Letter Ballot.
#
When
TF
Details
6389Cycle 4-2018NA 3DP&I CommitteeReapproval of SEMI 3D3-0613, Guide for Multiwafer Transport and Storage Containers for 300 mm, Thin Silicon Wafers on Tape Frames
6390Cycle 4-2018NA 3DP&I CommitteeReapproval of SEMI 3D5-0314, Guide for Metrology Techniques to be Used in Measurement of Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures


SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting

The next meeting is scheduled for Tuesday, July 10, 2018 in conjunction with SEMICON West at the Marriott Marquis in San Francisco, California. For more information, please visit the Standards Calendar at http://www.semi.org/en/standards.

        Wednesday, July 11
          13:00-16:00 FO-PLP Panel (TF)
        Thursday, July 12
          09:00-10:30 3DP&I Bonded Wafer Stacks and Inspection and Metrology (TFs)
          10:30-12:00 3DP&I (C)