SEMI International Standards
Standards Locale: North America |
Committee: 3D Packaging and Integration |
Place of Meeting: SEMI Headquarters, Milpitas, CA |
Date of Meeting: 04/10/2018 |
Meeting End Date: 04/10/2018 |
|
Recording SEMI Standards Staff: Laura Nguyen |
CER Posted to Web: 04/27/2018 |
Leadership Changes
None.
Committee Structure Changes
None.
Ballot Results
None.
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
# | Type | SC/TF/WG | Details |
6332 | SNARF | FO-PLP Panel TF | New Standard, Specification for Panel Substrate Characteristics for Fan-Out Panel Level Packaging (FO-PLP) Applications
– TC Member Review took place between 12/20/2017 and 01/03/2018 before approval by GCS on 01/11/2018 |
Authorized Activities
Listing of all revised or new SNARF(s) approved by the Originating TC Chapter.
# | Type | SC/TF/WG | Details |
6332 | SNARF | FO-PLP Panel TF | New Standard, Specification for Panel Substrate Characteristics for Fan-Out Panel Level Packaging (FO-PLP) Applications
– TC Member Review took place between 12/20/2017 and 01/03/2018 before approval by GCS on 01/11/2018 |
6075 | SNARF | 3DP&I Bonded Wafer Stacks | New Standard, Guide for Describing Glass and Quartz Based Material for Use in 3DS-IC Process
– Revision to SNARF title and scope. TC Member Review took place between 03/13/2018 and 03/26/2018 |
6389 | SNARF | NA 3DP&I Committee | Reapproval of SEMI 3D3-0613, Guide for Multiwafer Transport and Storage Containers for 300 mm, Thin Silicon Wafers on Tape Frames |
6390 | SNARF | NA 3DP&I Committee | Reapproval of SEMI 3D5-0314, Guide for Metrology Techniques to be Used in Measurement of Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures |
Note 1: SNARFs and TFOFs are available for review on the SEMI Web site at:
http://downloads.semi.org/web/wstdsbal.nsf/TFOFSNARF
Authorized Ballots
Listing of documents authorized by the Originating TC Chapter for Letter Ballot.
# | When | TF | Details |
6389 | Cycle 4-2018 | NA 3DP&I Committee | Reapproval of SEMI 3D3-0613, Guide for Multiwafer Transport and Storage Containers for 300 mm, Thin Silicon Wafers on Tape Frames |
6390 | Cycle 4-2018 | NA 3DP&I Committee | Reapproval of SEMI 3D5-0314, Guide for Metrology Techniques to be Used in Measurement of Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures |
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
None.
Next Meeting
The next meeting is scheduled for Tuesday, July 10, 2018 in conjunction with SEMICON West at the Marriott Marquis in San Francisco, California. For more information, please visit the Standards Calendar at http://www.semi.org/en/standards.
Wednesday, July 11
13:00-16:00 FO-PLP Panel (TF)
Thursday, July 12
09:00-10:30 3DP&I Bonded Wafer Stacks and Inspection and Metrology (TFs)
10:30-12:00 3DP&I (C)
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