SEMI International Standards
Standards Locale: North America
Committee: 3DS-IC
Place of Meeting: Marriott Marquis Hotel, San Francisco, California/USA
Date of Meeting: 07/12/2017
Meeting End Date: 07/12/2017
Recording SEMI Standards Staff: Laura Nguyen
CER Posted to Web: 07/24/2017


Leadership Changes
None.

Committee Structure Changes
The proposal to transform the 3DS-IC and Assembly & Packaging Committees into a single, unified global technical committee (GTC) was approved at the International Standards Committee (ISC) meeting held on July 13, 2017 during SEMICON West.

Proposal Details:
      • To transform the 3DS-IC GTC and the Assembly & Packaging GTC into a unified GTC
      • To name the transformed GTCs as "3D Packaging and Integration" GTC
      • Each TC chapter of the unified GTC will inherit the co-chairs of the existing TC chapters

Ballot Results

Document #
Document Title
Committee Action
A&R Forms for Approved Ballots
5822ANew Standard, Specification for Reference Material for Bonded Wafer Stack Void MetrologyPassed, with editorial changes5822AProceduralReview.pdf5822AProceduralReview.pdf
6179Reapproval of SEMI 3D1-0912, Terminology for Through Silicon via Geometrical MetrologyPassed, as balloted6179ProceduralReview.pdf6179ProceduralReview.pdf
Note 1: Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.

Note 2: Failed ballots and line items were returned to the originating task forces for re-work and re-balloting or abandoning.


Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities
None.

Authorized Ballots
None.

SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting
The next meeting of the 3D Packaging and Integration North America TC Chapter is scheduled for Tuesday, November 7, at the SEMI Standards North America Fall 2017 Meetings located at SEMI Headquarters in Milpitas, California.
For more information, please visit the Standards Calendar at http://www.semi.org/en/standards.

Tentative Schedule:

        Tuesday, November 7
          13:00-14:00 3DP&I Inspection and Metrology (TF)
          14:00-15:00 3DP&I Bonded Wafer Stacks (TF)
          15:00-17:00 3DP&I (C)