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SEMI International Standards
Standards Locale: Japan
Committee: Assembly & Packaging
Place of Meeting: SEMI Japan, Tokyo, Japan
Date of Meeting: 03/20/2014
Meeting End Date: 03/20/2014
Recording SEMI Standards Staff: Naoko Tejima
CER Posted to Web: 03/31/2014


Leadership Changes

Group
Previous Leader
New Leader
Packages and Packaging Materials Eco-efficiencyTask Force was disbanded.Shoichi Suzuki/ Sumitomo Metal Mining
Kazuhiko Nakamura/ Consultant
None
Wafer Shipping Container for Assembly & Packaging Task Force was disbanded.Yasuhiro Shimizu/ Consultant
Kazuhiko Nakamura/ Consultant
Tatsuya Yanagawa/ Achilles
None
Thin Chip Handling Task Force was newly set up.None.Hideki Suzuki (Shin-Etsu Polymer)
Kazuhiko Nakamura (Consultant)
Packaging 5 Year Review Task Force was newly set up.None.Masahiro Tsuriya (iNEMI)
Kazunori Kato (AiT)



Committee Structure Changes
None.

Ballot Results

Document #Document TitleCommittee ActionA&R Forms forApproved Ballots
5636Revision of SEMI G92-0412, Specification for Tape Frame Cassette for 450mm WaferPassed with editorial change5636_Ballot_Report.pdf5636_Ballot_Report.pdf


Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities

#
Type
SC/TF/WG
Details
--
--
Thin Chip Handling TFA task force was newly set up to explore the possibility of the Standardization of Thin Chip Handling.
--
--
5 Year Review TFA task force was newly set up to update Standards related to Assembly and packaging with latest information and industry accepted terms.


Authorized Ballots
None.

SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
The committee charter was reviewed. Revised version was approved and will propose to JRSC in April.

Next Meeting
SEMI Japan Standards Spring 2014 Meetings
Thursday, May 8, 2014, 15:00-17:00, SEMI Japan, Ichigaya, Tokyo, Japan











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