SEMI International Standards
Standards Locale: Japan
Committee: Silicon Wafer
Place of Meeting: SEMI Japan /OVTCCM
Date of Meeting: 04/13/2023
Meeting End Date: 04/13/2023
Recording SEMI Standards Staff: Mami Nakajo
CER Posted to Web: 04/27/2023


Leadership Changes
None.

Committee Structure Changes

Previous WG/TF/SC Name
New WG/TF/SC Name or Status Change
JA Shipping Box TFDisband


Ballot Results
None.

Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities
None.

Authorized Ballots
None.

SNARF(s) Granted a One-Year Extension

#
TF
Title
Expiration Date
5772Japan Test Method Task ForceRevision of MF391-0310: Test Methods for Minority Carrier Diffusion Length in Extrinsic Semiconductors by Measurement of Steady-state Surface photovoltage2024/09/11
6687Japan Test Method Task ForceRevision of M51: Test Method for Characterizing Silicon Wafer by Gate Oxide Integrity2024/10/02


SNARF(s) Abolished
None.

Standard(s) to receive Inactive Status

Standard Designation
Title
SEMI M31-0718Specification for Mechanical Features of Front-Opening Shipping Box Used to Transport and Ship 300 mm Wafers


Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting
The next meeting is scheduled for Friday, August 25, 10:00am-12:00[JST](Hybrid)
Please check www.semi.org/standards for updates.