SEMI International Standards
| Standards Locale: North America |
| Committee: 3D Packaging and Integration |
| Place of Meeting: SEMI Headquarters, Milpitas, California/USA |
| Date of Meeting: 11/09/2023 |
| Meeting End Date: 11/09/2023 |
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| Recording SEMI Standards Staff: Laura Nguyen |
| CER Posted to Web: 11/20/2023 |
Leadership Changes
None.
Committee Structure Changes
None.
Ballot Results
Document # | Document Title | TC Chapter Action#1,2 | A&R Forms for Approved Ballots |
| 7101 | Revision to SEMI 3D5-0314 (Reapproved 1218), Guide for Metrology Techniques to be Used in Measurement of Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures | Passed, as balloted. |  7101_ProceduralReview.pdf |
#1: Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.
#2: Failed ballots and line items were returned to the originating task forces for re-work and re-balloting or abandoning.
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
Authorized Ballots
Listing of documents authorized by the Originating TC Chapter for Letter Ballot.
# | When | TF | Details |
| 7100 | Cycle 1 or 2-2024 | 3DP&I Inspection & Metrology TF | Revision to SEMI 3D4-0915 (Reapproved 0222), Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks |
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
None.
Next Meeting
The next meeting is tentatively scheduled for the week of March 25-28, in conjunction with NA Standards Spring Meetings 2024. Schedule details TBD. Please check www.semi.org/standards for updates.
Tentative Schedule:
· Thursday, March 28
o TBD, Panel Level Packaging (PLP) Panel TF
o 11:00-12:00, Joint 3DP&I Bonded Wafer Stacks Task Force, and 3DP&I Inspection & Metrology Task Force
o 13:00-14:30, 3DP&I NA TC Chapter
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