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SEMI International Standards
Standards Locale: North America
Committee: Metrics
Place of Meeting: Milpitas/CA
Date of Meeting: 03/28/2024
Meeting End Date:
Recording SEMI Standards Staff: Michelle Sun
CER Posted to Web: 04/05/2024


Leadership Changes
None.

Committee Structure Changes
None.

Ballot Results

Document #
Document Title
TC Chapter Action
A&R Forms for Approved Ballots
7129ANew Standard: Test Method for Measuring Particles and Contamination by A Liquid Particle Counter of Critical Chamber Components Used in Semiconductor Wafer Processing and InspectionFailed
7130ANew Standard: Test Method for Measuring Surface Contamination by Particle Concentration Through Replacement Substrate and Optical Metrology of Critical Chamber Components Used in Semiconductor Wafer Processing and InspectionFailed
6894Line Item Revision to E33-0217E, Guide for Semiconductor Manufacturing Equipment Electromagnetic Compatibility (EMC) and E176-1017, Guide to Assess and Minimize Electromagnetic Interference (EMI) in a Semiconductor Manufacturing EnvironmentAR - 6894.pdfAR - 6894.pdf
LI-1Move Appendix 1 from SEMI E33 to E176Failed
LI-2Update References and Other Editorial ChangesPassed with editorial changes


Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting

#
Type
SC/TF/WG
Details
LiaisonEMC TFApproval of Gregory Larson (Intel) to be the official representative of SEMI, who makes technical contributions to and participates actively in the work of IEC TC 77 / Working Group 13
6894Ballot AuthorizationEMC TFLine Item Revision to E33-0217E, Guide for Semiconductor Manufacturing Equipment Electromagnetic Compatibility (EMC) and E176-1017, Guide to Assess and Minimize Electromagnetic Interference (EMI) in a Semiconductor Manufacturing Environment


Authorized Activities
None.

Authorized Ballots

#
When
TF
Details
7129BCycle 4 or 5-2024CCC TFNew Standard: Test Method for Measuring Particles and Contamination by A Liquid Particle Counter of Critical Chamber Components Used in Semiconductor Wafer Processing and Inspection
7130BCycle 4 or 5-2024CCC TFNew Standard: Test Method for Measuring Surface Contamination by Particle Concentration Through Replacement Substrate and Optical Metrology of Critical Chamber Components Used in Semiconductor Wafer Processing and Inspection


SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting
The next meeting is tentatively scheduled for Tuesday, July 9, 2024, at SEMICON West. See http://www.semi.org/standards-events for the current list of events.











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