SEMI International Standards
Standards Locale: Japan
Committee: 3D Packaging and Integration
Place of Meeting: Web Conference
Date of Meeting: 01/18/2021
Meeting End Date: 01/18/2021
Recording SEMI Standards Staff: Mami Nakajo
CER Posted to Web: 01/21/2021


Leadership Changes
None.

Committee Structure Changes
None.

Ballot Results

Document #
Document Title
Committee Action
A&R Forms for Approved Ballots
6590New Standard: Specification for Glass Carrier Characteristics for Panel Level Packaging (PLP) ApplicationsPassed as ballotedBallot report_6590_rev1.pdfBallot report_6590_rev1.pdf


Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities

#
Type
SC/TF/WG
Details
6703SNARF3D Packaging & Integration 5 Year Review TFSNARF for: Revision to SEMI G63-95 (Reapproved 0811) “Test Method for Measurement of Die Shear Strength”
6706SNARFEncapsulation Characteristics for Wafer Level Package and Panel Level Packaging Panel TFSNARF for: New Standard: Specification for CTE and Tg Measurement Methodology for PLP/WLP Encapsulation Materials
6707SNARFEncapsulation Characteristics for Wafer Level Package and Panel Level Packaging Panel TFSNARF for New Standard: Specification for Flowability Measurement Methodology for PLP/WLP Encapsulation materials
6708SNARFEncapsulation Characteristics for Wafer Level Package and Panel Level Packaging Panel TFSNARF for: New Standard: Specification for Gel Time Measurement Methodology for PLP/WLP Encapsulation materials
6709SNARFEncapsulation Characteristics for Wafer Level Package and Panel Level Packaging Panel TFSNARF for: New Standard: Specification for Modulus Measurement Methodology for PLP/WLP Encapsulation materials
6710SNARFEncapsulation Characteristics for Wafer Level Package and Panel Level Packaging Panel TFSNARF for: New Standard: Specification for Shear Strength Measurement Methodology for PLP/WLP Encapsulation Materials
6711SNARFEncapsulation Characteristics for Wafer Level Package and Panel Level Packaging Panel TFSNARF for: New Standard: Specification for Viscosity Measurement Methodology for PLP/WLP Encapsulation materials
6712SNARFEncapsulation Characteristics for Wafer Level Package and Panel Level Packaging Panel TFSNARF for: New Standard: Specification for Wettability Measurement Methodology for PLP/WLP Encapsulation materials


Authorized Ballots

#
When
TF
Details
6703Cycle 3-20213D Packaging & Integration 5 Year Review TFSNARF for: Revision to SEMI G63-95 (Reapproved 0811) “Test Method for Measurement of Die Shear Strength”
6706CycleX-2021Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging Panel TFSNARF for: New Standard: Specification for CTE and Tg Measurement Methodology for PLP/WLP Encapsulation Materials
6707CycleX-2021Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging Panel TFSNARF for New Standard: Specification for Flowability Measurement Methodology for PLP/WLP Encapsulation materials
6708CycleX-2021Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging Panel TFSNARF for: New Standard: Specification for Gel Time Measurement Methodology for PLP/WLP Encapsulation materials
6709CycleX-2021Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging Panel TFSNARF for: New Standard: Specification for Modulus Measurement Methodology for PLP/WLP Encapsulation materials
6710CycleX-2021Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging Panel TFSNARF for: New Standard: Specification for Shear Strength Measurement Methodology for PLP/WLP Encapsulation Materials
6711CycleX-2021Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging Panel TFSNARF for: New Standard: Specification for Viscosity Measurement Methodology for PLP/WLP Encapsulation materials
6712CycleX-2021Encapsulation Characteristics for Wafer Level Package and Panel Level Packaging Panel TFSNARF for: New Standard: Specification for Wettability Measurement Methodology for PLP/WLP Encapsulation materials


SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting

The next meeting is scheduled for Friday, May 28,2021,14:00-17:00 at SEMI Japan office /WEB