SEMI International Standards
Committee Structure Changes
Ratification Ballot Results
Activities Approved by the GCS between meetings of TC Chapter meeting
|Standards Locale: North America|
|Committee: Silicon Wafer|
|Place of Meeting: SEMI HQ, Milpitas, CA|
|Date of Meeting: 04/04/2023|
|Meeting End Date: 04/04/2023|
|Recording SEMI Standards Staff: Kevin Nguyen|
|CER Posted to Web: 04/13/2023|
|7024||SNARF||Int’l Polished TF||Line Item Revision to SEMI M1-0918,Specification for Polished Single Crystal Silicon Wafers|
|7025||SNARF||Int’l Test Methods TF||Line Item Revision to SEMI MF1529-1110: Test Method for “Sheet Resistance Uniformity Evaluation by In-Line Four-Point Probe with the Dual-Configuration Procedure” |
SNARF(s) Granted a One-Year Extension
Standard(s) to receive Inactive Status
SEMI M74-1108 (Reapproved 1018) Specification for 450 mm Diameter Mechanical Handling Polished Wafers.
Special Announcements of the Committee (Workshops, Programs, etc.)
July 11, 2024 9 AM- Noon Pacific, Moscone Center, San Francisco, CA in conjunction with SEMICON West. Check www.semi.org/standards for the latest update.
|7025||Cycle 4, 5-2023||Int’l Test Methods TF||Line Item Revision of SEMI MF1529-1110: Test Method for “Sheet Resistance Uniformity Evaluation by In-Line Four-Point Probe with the Dual-Configuration Procedure” |
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