SEMI International Standards
Standards Locale: North America
Committee: Silicon Wafer
Place of Meeting: SEMI HQ, Milpitas, CA
Date of Meeting: 04/04/2023
Meeting End Date: 04/04/2023
Recording SEMI Standards Staff: Kevin Nguyen
CER Posted to Web: 04/13/2023


Leadership Changes
None.

Committee Structure Changes
None.

Ballot Results
None.

Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities

#
Type
SC/TF/WG
Details
7024SNARFInt’l Polished TFLine Item Revision to SEMI M1-0918,Specification for Polished Single Crystal Silicon Wafers
7025SNARFInt’l Test Methods TFLine Item Revision to SEMI MF1529-1110: Test Method for “Sheet Resistance Uniformity Evaluation by In-Line Four-Point Probe with the Dual-Configuration Procedure”


Authorized Ballots

#
When
TF
Details
7025Cycle 4, 5-2023Int’l Test Methods TFLine Item Revision of SEMI MF1529-1110: Test Method for “Sheet Resistance Uniformity Evaluation by In-Line Four-Point Probe with the Dual-Configuration Procedure”


SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Abolished
None.

Standard(s) to receive Inactive Status
SEMI M74-1108 (Reapproved 1018) Specification for 450 mm Diameter Mechanical Handling Polished Wafers.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting
July 11, 2024 9 AM- Noon Pacific, Moscone Center, San Francisco, CA in conjunction with SEMICON West. Check www.semi.org/standards for the latest update.