SEMI International Standards
Standards Locale: Japan
Committee: 3D Packaging and Integration
Place of Meeting: OVTCCM
Date of Meeting: 09/05/2023
Meeting End Date: 09/05/2023
Recording SEMI Standards Staff: Mami Nakajo
CER Posted to Web: 09/20/2023


Leadership Changes
None.

Committee Structure Changes
None.

Ballot Results

Document #
Document Title
TC Chapter Action
A&R Forms for Approved Ballots
7019Reapproval of SEMI G64-1118,Specification for Full-Plated Integrated Circuit Leadframes (Au, Ag, Cu, Ni, Pd/Ni, Pd)Passed as balloted7019_Ballot Report Template_final.pdf7019_Ballot Report Template_final.pdf
7020Reapproval of SEMI G94-0113 (Reapproved 1118) Specification for Coin-Stack Type Tape Frame Shipping Container for 300 mm WaferPassed as balloted


Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities
None.

Authorized Ballots
None.

SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Abolished
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting

Friday, January 26,2024,15:00-17:00 [JST] @ OVTCCM