SEMI International Standards
Standards Locale: Japan
Committee: 3D Packaging and Integration
Place of Meeting: SEMI Japan office, Tokyo, Japan
Date of Meeting: 07/10/2020
Meeting End Date: 07/10/2020
Recording SEMI Standards Staff: Chie Yanagisawa
CER Posted to Web: 07/21/2020


Leadership Changes
None.

Committee Structure Changes
None.

Ballot Results

Document #
Document Title
Committee Action
A&R Forms for Approved Ballots
6497ALine Item Revision to SEMI G95-0314 with non-conforming title change to "Specification for Mechanical Features of 450 mm Load Port for Tape Frame Cassettes in The Backend Process"
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6497A_BallotReport(Line Item)_r1.pdf6497A_BallotReport(Line Item)_r1.pdf
Line Item 1Document title is changed based on A4-1-4 of procedure manualPassed as balloted
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6635Reapproval of SEMI G74-0699 (Reapproved 0215) Specification for Tape Frame for 300 mm WafersPassed as balloted6635_BallotReport_G74_Reapproval_r1.pdf6635_BallotReport_G74_Reapproval_r1.pdf
6636Reapproval of SEMI G77-0699 (Reapproved 0215) Specification for Frame Cassette for 300 mm WafersPassed as balloted6636_BallotReport_G77_Reapproval_r1.pdf6636_BallotReport_G77_Reapproval_r1.pdf
6637Reapproval of SEMI G82-1115 Specification for 300 mm Load Port for Frame Cassettes in Backend ProcessPassed as balloted6637_BallotReport_G82_Reapproval_r1.pdf6637_BallotReport_G82_Reapproval_r1.pdf
6638Reapproval of SEMI G87-1108 (Reapproved 0215) Specification for Plastic Tape Frame for 300 mm WaferPassed as balloted6638_BallotReport_G87_Reapproval_r1.pdf6638_BallotReport_G87_Reapproval_r1.pdf
6639Reapproval of SEMI G92-0315 Specification for Tape Frame Cassette for 450 mm WaferPassed as balloted6639_BallotReport_G92_Reapproval_r1.pdf6639_BallotReport_G92_Reapproval_r1.pdf
6640Revision to SEMI G52-1115 Test Method For Measurement Of Ionic Contamination On Semiconductor LeadframesPassed as balloted6640_BallotReport_G52_Reapproval_r1.pdf6640_BallotReport_G52_Reapproval_r1.pdf
The following ballots reviews are transferred from NA TC Chapter (approved by the GCS)
6631:Line Item Revision to SEMI 3D12-0315, Guide for Measuring Flatness and Shape of Low Stiffness Wafers
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6631_Ballot Line-Item report_r2.pdf6631_Ballot Line-Item report_r2.pdf
Line Item 1Clarify the Purpose statement in ¶1.3.Passed with editorial changes
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Line Item 2Add definition of precise monofilament and revise definitions in Terminology §5 for clarity.Passed as balloted
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6591Revision to SEMI 3D20-0719, Specification for Panel Characteristics for Panel Level Packaging (PLP) ApplicationsFailed and returned to the TF for rework6591_Ballot Report.pdf6591_Ballot Report.pdf
Note 1: Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.

Note 2: Failed ballots and line items were returned to the originating task forces for re-work and re-balloting or abandoning.


Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
No activity requested by the Japan TC Chapter between meetings.
*The NA TC Chapter requested for transferring the ballot reviews of 6591 and 6631 at the Japan TC Chapter meeting on July 10 and the GCS approved them.

Authorized Activities
None.

Authorized Ballots

#
When
TF
Details
6590Cycle X-2020PLP Glass Carrier TFNew Standard: Specification for Glass Carrier Characteristics for Panel Level Packaging (PLP) Applications
6496Cycle X-20203D Packaging & Integration 5 Year Review TFLine Item Revision to SEMI G63-95 (Reapproved 0811) “Test Method for Measurement of Die Shear Strength”


SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting
The next TC Chapter meeting will be held as follows.

    • Date: Friday, November 13
    • Time: 15-17 [JST]
    • Place: SEMI Japan office, Tokyo Japan