SEMI International Standards
| Standards Locale: North America |
| Committee: 3D Packaging and Integration |
| Place of Meeting: Moscone Center, San Francisco, California/USA |
| Date of Meeting: 07/13/2023 |
| Meeting End Date: 07/13/2023 |
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| Recording SEMI Standards Staff: Laura Nguyen |
| CER Posted to Web: 07/28/2023 |
Leadership Changes
None.
Committee Structure Changes
None.
Ballot Results
Document # | Document Title | TC Chapter Action#1,2 | A&R Forms for Approved Ballots |
| 7099 | Revision to SEMI 3D3-0613 (Reapproved 1218), Guide for Multiwafer Transport and Storage Containers for 300 mm, Thin Silicon Wafers on Tape Frames | Passed, as balloted. |  7099_ProceduralReview.pdf |
| 7102 | Revision to SEMI 3D17-1217, Specification for Reference Material for Bonded Wafer Stack Void Metrology | Passed, as balloted. |  7102_ProceduralReview.pdf |
#1: Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.
#2: Failed ballots and line items were returned to the originating task forces for re-work and re-balloting or abandoning.
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
# | Type | SC/TF/WG | Details |
| 7099 | SNARF/
Ballot Authorization | 3DP&I Inspection & Metrology TF | Revision to SEMI 3D3-0613 (Reapproved 1218), Guide for Multiwafer Transport and Storage Containers for 300 mm, Thin Silicon Wafers on Tape Frames
– Approved by GCS on 05/30/2023 |
| 7100 | SNARF/
Ballot Authorization | 3DP&I Inspection & Metrology TF | Revision to SEMI 3D4-0915 (Reapproved 0222), Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks
– Approved by GCS on 05/30/2023 |
| 7101 | SNARF/
Ballot Authorization | 3DP&I Inspection & Metrology TF | Revision to SEMI 3D5-0314 (Reapproved 1218), Guide for Metrology Techniques to be Used in Measurement of Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures
– Approved by GCS on 05/30/2023 |
| 7102 | SNARF/
Ballot Authorization | 3DP&I Inspection & Metrology TF | Revision to SEMI 3D17-1217, Specification for Reference Material for Bonded Wafer Stack Void Metrology
– Approved by GCS on 05/30/2023 |
Authorized Activities
None.
Authorized Ballots
Listing of documents authorized by the Originating TC Chapter for Letter Ballot.
# | When | TF | Details |
| 7100 | Ballot Authorization | 3DP&I Inspection & Metrology TF | Revision to SEMI 3D4-0915 (Reapproved 0222), Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks |
| 7101 | Ballot Authorization | 3DP&I Inspection & Metrology TF | Revision to SEMI 3D5-0314 (Reapproved 1218), Guide for Metrology Techniques to be Used in Measurement of Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures |
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Abolished
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
None.
Next Meeting
The next meeting is tentatively scheduled for the week of November 6-9, in conjunction with SEMI Standards NA Fall Meetings 2023. Schedule details TBD. Please check www.semi.org/standards for updates.
Tentative Schedule
- Thursday, November 9
TBD, PLP Panel TF
11:00-12:00, Joint 3DP&I Bonded Wafer Stacks Task Force, and 3DP&I Inspection & Metrology Task Force
13:00-14:00, 3DP&I NA TC Chapter
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