SEMI International Standards
Standards Locale: Japan |
Committee: 3D Packaging and Integration |
Place of Meeting: SEMI Japan office, Tokyo |
Date of Meeting: 03/06/2020 |
Meeting End Date: 03/06/2020 |
|
Recording SEMI Standards Staff: Chie Yanagisawa |
CER Posted to Web: 03/10/2020 |
Leadership Changes
None.
Committee Structure Changes
None.
Ballot Results
None.
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
Listing of all revised or new SNARF(s) approved by the Originating TC Chapter.
# | Type | SC/TF/WG | Details |
TBD | New SNARF | 3D Packaging & Integration 5 Year Review TF | New SNARF for Revision to SEMI G52-1115, “Test Method for Measurement of Ionic Contamination on Semiconductor Leadframes” |
TBD | New SNARF | 450 mm Assembly & Test Die Preparation (ATDP) TF | New SNARF for Reapproval of SEMI G74-0699 (Reapproved 0215), “Specification for Tape Frame for 300 mm Wafers” |
TBD | New SNARF | 450 mm Assembly & Test Die Preparation (ATDP) TF | New SNARF for Reapproval of SEMI G77-0699 (Reapproved 0215), “Specification for Frame Cassette for 300 mm Wafers” |
TBD | New SNARF | 450 mm Assembly & Test Die Preparation (ATDP) TF | New SNARF for Reapproval of SEMI G82-1115, “Specification for 300 mm Load Port for Frame Cassettes in Backend Process” |
TBD | New SNARF | 450 mm Assembly & Test Die Preparation (ATDP) TF | New SNARF for Reapproval of SEMI G87-1108 (Reapproved 0215), “Specification for Plastic Tape Frame for 300 mm Wafer” |
TBD | New SNARF | 450 mm Assembly & Test Die Preparation (ATDP) TF | New SNARF for Reapproval of SEMI G92-0315, “Specification for Tape Frame Cassette for 450 mm Wafer” |
Note 1: SNARFs and TFOFs are available for review on the SEMI Web site at:
http://downloads.semi.org/web/wstdsbal.nsf/TFOFSNARF
Authorized Ballots
Listing of documents authorized by the Originating TC Chapter for Letter Ballot.
# | When | TF | Details |
TBD | Cycle 4-2020 | 3D Packaging & Integration 5 Year Review TF | Revision to SEMI G52-1115, “Test Method for Measurement of Ionic Contamination on Semiconductor Leadframes” |
TBD | Cycle 4-2020 | 450 mm Assembly & Test Die Preparation (ATDP) TF | Reapproval of SEMI G74-0699 (Reapproved 0215), “Specification for Tape Frame for 300 mm Wafers” |
TBD | Cycle 4-2020 | 450 mm Assembly & Test Die Preparation (ATDP) TF | Reapproval of SEMI G77-0699 (Reapproved 0215), “Specification for Frame Cassette for 300 mm Wafers” |
TBD | Cycle 4-2020 | 450 mm Assembly & Test Die Preparation (ATDP) TF | Reapproval of SEMI G82-1115, “Specification for 300 mm Load Port for Frame Cassettes in Backend Process” |
TBD | Cycle 4-2020 | 450 mm Assembly & Test Die Preparation (ATDP) TF | Reapproval of SEMI G87-1108 (Reapproved 0215), “Specification for Plastic Tape Frame for 300 mm Wafer” |
TBD | Cycle 4-2020 | 450 mm Assembly & Test Die Preparation (ATDP) TF | Reapproval of SEMI G92-0315, “Specification for Tape Frame Cassette for 450 mm Wafer” |
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
The PLP Standardization related program hosted by the 3DP&I Japan TC Chapter to be held during SEMICON Japan 2020.
Next Meeting
The next TC Chapter meeting will be held as follows.
Friday, July 10, 2020
14:30-17:30
SEMI Japan office, Tokyo, Japan
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