SEMI International Standards
Standards Locale: Japan
Committee: Physical Interfaces & Carriers
Place of Meeting: SEMI Japan office
Date of Meeting: 07/21/2023
Meeting End Date: 07/21/2023
Recording SEMI Standards Staff: Mami Nakajo
CER Posted to Web: 08/03/2023


Leadership Changes
None.

Committee Structure Changes
None.

Ballot Results
None.

Ratification Ballot Results

Document #
Document Title
ISC A&R Action
A&R Forms
R6897Ratification Ballot Revision to SEMI E92-0302E(Reapproved 0615),
SPECIFICATION FOR 300 MM LIGHT WEIGHT AND COMPACT BOX OPENER/LOADER TO TOOL-INTEROPERABILITY STANDARD (Bolts/Light)　		Passed


Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities

#
Type
SC/TF/WG
Details
TBDSNARFPanel Level Packaging (PLP) Panel FOUP Task ForceLine Item Revision to SEMI E181-0423 - SPECIFICATION FOR PANEL FOUP FOR PANEL LEVEL PACKAGING,
SEMI E181.1-0423 - SPECIFICATION FOR PANEL FOUP FOR 510 mm – 515 mm PANEL SIZE and 12 SLOTS,
SEMI E181.2-0423 - SPECIFICATION FOR PANEL FOUP FOR 510 mm – 515 mm PANEL SIZE and 6 SLOTS,
SEMI E181.3-0423 - SPECIFICATION FOR PANEL FOUP FOR 600 mm – 600 mm PANEL SIZE and 12 SLOTS, and
SEMI E181.4-0423 - SPECIFICATION FOR PANEL FOUP FOR 600 mm – 600 mm PANEL SIZE and 6 SLOTS
TBDSNARFPanel Level Packaging (PLP) Panel FOUP Task ForceLine Item Revision to Line Item Revision to SEMI E182-0621 - SPECIFICATION FOR PANEL FOUP LOADPORT FOR PANEL LEVEL PACKAGING


Authorized Ballots

#
When
TF
Details
TBDCycle7-2023Panel Level Packaging (PLP) Panel FOUP Task ForceLine Item Revision to SEMI E181-0423 - SPECIFICATION FOR PANEL FOUP FOR PANEL LEVEL PACKAGING,
SEMI E181.1-0423 - SPECIFICATION FOR PANEL FOUP FOR 510 mm – 515 mm PANEL SIZE and 12 SLOTS,
SEMI E181.2-0423 - SPECIFICATION FOR PANEL FOUP FOR 510 mm – 515 mm PANEL SIZE and 6 SLOTS,
SEMI E181.3-0423 - SPECIFICATION FOR PANEL FOUP FOR 600 mm – 600 mm PANEL SIZE and 12 SLOTS, and
SEMI E181.4-0423 - SPECIFICATION FOR PANEL FOUP FOR 600 mm – 600 mm PANEL SIZE and 6 SLOTS
TBDCycle7-2023Panel Level Packaging (PLP) Panel FOUP Task ForceLine Item Revision to Line Item Revision to SEMI E182-0621 - SPECIFICATION FOR PANEL FOUP LOADPORT FOR PANEL LEVEL PACKAGING


SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Abolished
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting
Thursday December 14, 13:00-16:00 [JST] @ SEMICON Japan via OVTCCM