SEMI International Standards
Standards Locale: North America
Committee: 3D Packaging and Integration
Place of Meeting: SEMI Headquarters, Milpitas, California/USA
Date of Meeting: 04/06/2023
Meeting End Date: 04/06/2023
Recording SEMI Standards Staff: Laura Nguyen
CER Posted to Web: 04/19/2023


Leadership Changes
None.

Committee Structure Changes
None.

Ballot Results
None.

Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities
None.

Authorized Ballots
None.

SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Abolished

#
TF
Title
69723DP&I Inspection and Metrology TFLine-Item Revision to SEMI 3D17-1217, Specification for Reference Material for Bonded Wafer Stack Void Metrology
[Abandoned SNARF, Revision SNARF to be issued]


Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting

The next meeting is tentatively scheduled for the week of July 10-13, in conjunction with SEMICON West 2023. Schedule details TBD. Please check www.semi.org/standards for updates.

Tentative Schedule:


    Thursday, July 13
        o ???, PLP Panel TF

        o 11:00-13:00, Joint 3DP&I Bonded Wafer Stacks Task Force, and 3DP&I Inspection & Metrology Task Force

        o 13:00-14:30, 3DP&I NA TC Chapter