SEMI International Standards
| Standards Locale: Japan |
| Committee: Silicon Wafer |
| Place of Meeting: Tokyo Big Sight/OVTCCM |
| Date of Meeting: 12/14/2023 |
| Meeting End Date: 12/14/2023 |
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| Recording SEMI Standards Staff: Mami Nakajo |
| CER Posted to Web: 01/04/2024 |
Leadership Changes
WG/TF/SC/TC Name | Previous Leader | New Leader |
| International Test Method TF | | Mikako Omata ( SCAS ) |
| International Polished Wafers TF under Europe Silicon Wafer TC Chapter | Frank Riedel ( Siltronic ) | Christina Sanna (GlobalWafers) |
| International Advanced Surface Inspection TF under Europe Silicon Wafer TC Chapter | Frank Riedel ( Siltronic ) | Judith Wittmann (Siltronic) |
Committee Structure Changes
None.
Ballot Results
None.
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
None.
Authorized Ballots
None.
SNARF(s) Granted a One-Year Extension
# | TF | Title | Expiration Date |
| 6570 | International Test Methods Task Force | SNARF for: New Standard: Guide for Measuring Bulk Micro Defect Density and Denuded Zone Width in Annealed Silicon Wafers by a Laser-Scattering Tomography Technique | 2025/04/19 |
| 6702 | Japan Test Method Task Force | SNARF for: Revision of M60: TEST METHOD FOR TIME DEPENDENT DIELECTRIC BREAKDOWN CHARACTERISTICS OF Amorphous SiO2 FILMS FOR Silicon WAFER EVALUATION | 2025/1/15 |
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
None.
Next Meeting
The next meeting is scheduled for Friday, April 26, 10:00am-12:00[JST] via OVTCCM
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