SEMI International Standards
| Standards Locale: China |
| Committee: Compound Semiconductor Materials |
| Place of Meeting: Wuxi,jiangsu |
| Date of Meeting: 01/25/2024 |
| Meeting End Date: |
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| Recording SEMI Standards Staff: Cassie Li |
| CER Posted to Web: 02/20/2024 |
Leadership Changes
None.
Committee Structure Changes
None.
Ballot Results
None.
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
None.
Authorized Activities
None.
Authorized Ballots
# | When | TF | Details |
| Compound Semiconductor Materials |
| 6769 | Cycle2-24
orCycle3-24 | Silicon Carbide Substrate Task Force | New Standard: Test Method for Residual Stress of Silicon Carbide Wafers by Photoelastic |
| HB-LED |
| None | | | |
SNARF(s) Granted a One-Year Extension
# | TF | Title | Expiration Date |
| Compound Semiconductor Materials |
| 6767 | Silicon Carbide Substrate Task Force | New Standard: Test Method for GBIR, SBIR, GF3R, SFQR and SORI of Silicon Carbide Wafers by Oblique Incident Interference Method | 2025/4/8 |
| 6769 | Silicon Carbide Substrate Task Force | New Standard: Test Method for Residual Stress of Silicon Carbide Wafers by Photoelastic | 2025/4/8 |
| HB-LED |
| None | | | |
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
None.
Next Meeting
The next meeting of the Compound Semiconductor Materials & HB-LED China TC Chapter is scheduled for TBD, 2024, China.
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