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SEMI International Standards
Standards Locale: Japan
Committee: 3D Packaging and Integration
Place of Meeting: SEMI Japan office, Tokyko, Japan
Date of Meeting: 06/07/2019
Meeting End Date: 06/07/2019
Recording SEMI Standards Staff: Chie Yanagisawa
CER Posted to Web: 06/12/2019


Leadership Changes

WG/TF/SC/TC Name
Previous Leader
New Leader
Panel Level Packaging (PLP) Glass Carrier Task ForceNot applicable
*TF is newly formed.
Mark Takahashi (Namics Corporation)


Committee Structure Changes

WG/TF/SC/TC Name
Previous Leader
New Leader
Panel Level Packaging (PLP) Glass Carrier Task ForceNot applicable
*TF is newly formed.
Mark Takahashi (Namics Corporation)


Ballot Results

Document #
Document Title
Committee Action
A&R Forms for Approved Ballots
6497Line Item Revision to SEMI G95-0314 with non-conforming title change to "Specification for Mechanical Features of 450 mm Load Port for Tape Frame Cassettes in The Backend Process"--#6497_BallotReviewSheet.pdf#6497_BallotReviewSheet.pdf
Line Item 1Document title is changed based on A4-1-4 of procedure manualPassed, with editorial change--
6498Reapproval of SEMI G96-1014 Test Method for Measurement of Chip (Die) Strength by Mean of Cantilever BendingPassed, as balloted#6498_BallotReviewSheet.pdf#6498_BallotReviewSheet.pdf
Note 1: Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.

Note 2: Failed ballots and line items were returned to the originating task forces for re-work and re-balloting or abandoning.


Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities
None.

Authorized Ballots
None.

SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status

Standard Designation
Title
SEMI G75-0698 (Reapproved 0615)Standard Test Method of the Properties of Leadframe Tape
SEMI G81-0307 (Reapproved 0315)Specification for Map Data Items


Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting
The next TC Chapter meeting will be held as follows.

  • Friday, October 11, 2019
  • 15:00-17:00
  • SEMI Japan office, Tokyo, Japan











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