SEMI International Standards
Standards Locale: North America
Committee: Silicon Wafer
Place of Meeting: Moscone South Hall - San Francisco, CA
Date of Meeting: 07/09/2019
Meeting End Date: 07/09/2019
Recording SEMI Standards Staff: Kevin Nguyen
CER Posted to Web: 07/17/2019


Leadership Changes
None.

Committee Structure Changes
None.

Ballot Results

Document #
Document Title
Committee Action
A&R Forms for Approved Ballots
6425Line Item Revision to SEMI M1-0918, Specification for Polished Single Crystal Silicon Wafers
Line Item 1Remove references to PV13 and add footnote 9Failed and Returned to Task Force
6461 Reapproval of SEMI M73-1013E, Test Method For Extracting Relevant Characteristics From Measured Wafer Edge ProfilesPassed as balloted6461 A&R.pdf6461 A&R.pdf
6501Reapproval of SEMI M35-1114, Guide For Developing Specifications For Silicon Wafer Surface Features Detected By Automated InspectionPassed as balloted6501 A&R.pdf6501 A&R.pdf
6440Revision of SEMI M71-0912 Specification for Silicon-on-Insulator (SOI) Wafers for CMOS LSIPassed as balloted6440 A&R.pdf6440 A&R.pdf
6519Revision of SEMI M53-0219, Practice for Calibrating Scanning Surface Inspection Systems Using Certified Depositions of Monodispere Reference Spheres on Unpatterned Semiconductor Wafer SurfacesPassed with technical changes. Ratification Ballot will be issued.6519 A&R.pdf6519 A&R.pdf
5834Line Item Revision to SEMI M85-1014: Guide for the Measurement of Trace Metal Contamination on Silicon Wafer Surface by Inductively Coupled Plasma Mass Spectrometry5834 A&R.pdf5834 A&R.pdf
Line Item 1Adding some explanations to 10.1.7Passed as balloted
Line Item 2 adding some explanation to NOTE 4Passed with editorial changes
Line Item 3Changing some words in 12.3.1Passed as balloted
Line Item 4Changing some words in 12.3.2Passed as balloted
6526New Standard: Test Method for Bulk Microdefect density and Denuded Zone Width in Annealed Silicon Wafers by Optical Microscopy after Preferential EtchingFailed and Returned to Task Force
SEMI M73-1013ETest Method For Extracting Relevant Characteristics From Measured Wafer Edge Profiles
(Editorial changes)
PassedM73_Ballot_Report_Editorial_Changes.pdfM73_Ballot_Report_Editorial_Changes.pdf
SEMI M58-1109 R-0614Test Method For Evaluating DMA Based Particle Deposition Systems And Processes

(Editorial changes)

PassedM58_Ballot_Report_Editorial_Changes.pdfM58_Ballot_Report_Editorial_Changes.pdf



Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities

#
Type
SC/TF/WG
Details
tbdSNARFInt'l ASI TFReapproval of SEMI M58 Test Method For Evaluating DMA Based Particle Deposition Systems And Processes
6554SNARFInt'l Test Methods TFNew Standard: Practice for Carrier profiling of semiconductors by Scanning Capacitance Microscopy and Scanning Spreading Resistance Microscopy


Authorized Ballots

#
When
TF
Details
tbdcycle 7-19Int'l ASI TFReapproval of SEMI M58 Test Method For Evaluating DMA Based Particle Deposition Systems And Processes
R6519cycle 6-19Int'l ASI TFRatification Ballot - Revision of SEMI M53-0219, Practice for Calibrating Scanning Surface Inspection Systems Using Certified Depositions of Monodispere Reference Spheres on Unpatterned Semiconductor Wafer Surfaces


SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting
March 31, 2020 9 AM - Noon Pacific Time, Milpitas, CA in conjunction with NA Spring Meetings. Check www.semi.org/standards for more details.