CER - Japan Physical Interfaces & Carriers Committee Meeting held on 12/14/2023

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SEMI International Standards

Standards Locale: Japan

Committee: Physical Interfaces & Carriers

Place of Meeting: Tokyo Big Sight / OVTCCM

Date of Meeting: 12/14/2023

Meeting End Date: 12/14/2023

Recording SEMI Standards Staff: Mami Nakajo

CER Posted to Web: 12/25/2023

Leadership Changes

WG/TF/SC/TC Name	Previous Leader	New Leader
Next Gen Assembly / Test Material Handling TF		Stefan Radloff

Committee Structure Changes

Previous WG/TF/SC Name	New WG/TF/SC Name or Status Change
	Next Gen Assembly / Test Material Handling TF

Ballot Results

Document #	Document Title	TC Chapter Action	A&R Forms for Approved Ballots
7112	Line Item Revision to SEMI E181-0423 SPECIFICATION FOR PANEL FOUP FOR PANEL LEVEL PACKAGING, SEMI E181.1-0423 - SPECIFICATION FOR PANEL FOUP FOR 510 mm – 515 mm PANEL SIZE and 12 SLOTS, SEMI E181.2-0423 - SPECIFICATION FOR PANEL FOUP FOR 510 mm – 515 mm PANEL SIZE and 6 SLOTS, SEMI E181.3-0423 - SPECIFICATION FOR PANEL FOUP FOR 600 mm – 600 mm PANEL SIZE and 12 SLOTS, SEMI E181.4-0423 - SPECIFICATION FOR PANEL FOUP FOR 600 mm – 600 mm PANEL SIZE and 6 SLOTS		7112.pdf
LI-1	Clarify the area to prevent Panel FOUP from falling from AMHS in E181	Passed as balloted
LI-2	Modify the panel FOUP internal area considering mass production and that includes changing the definition of first slot height in E181, E181.1, E181.2, E181.3 and E181.4	Passed as balloted
LI-3	Delete the number of slots information in Figure 24 of E181	Passed as balloted
7113	Line Item Revision to Line Item Revision to SEMI E182-0621 - SPECIFICATION FOR PANEL FOUP LOADPORT FOR PANEL LEVEL PACKAGING		7113.pdf
LI-1	Change the y140 value	Passed as balloted
LI-2	Add the “APPLICATION NOTES” to the Related Information	Passed as balloted

Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities

#	Type	SC/TF/WG	Details
TBD	SNARF	Panel Level Packaging (PLP) Panel FOUP Task Force	Line Item Revision to SEMI E185-1222: Specification for 300 mm Tape Frame FOUP
TBD	SNARF	Panel Level Packaging (PLP) Panel FOUP Task Force	Line Item Revision to SEMI E184-1221E: Specification for 300 mm Tape Frame FOUP Load Port
TBD	SNARF	Next Gen Assembly / Test Material Handling Task Force	New Standard: Specification for Next Gen Assembly / Test Carrier

Authorized Ballots

#	When	TF	Details
TBD	Cycle2-2024	Panel Level Packaging (PLP) Panel FOUP Task Force	Line Item Revision to SEMI E185-1222: Specification for 300 mm Tape Frame FOUP
TBD	Cycle2-2024	Panel Level Packaging (PLP) Panel FOUP Task Force	Line Item Revision to SEMI E184-1221E: Specification for 300 mm Tape Frame FOUP Load Port

SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting

Date, time, location, event: Friday April 12, 13:00-16:00 [JST] via OVTCCM (Hybrid)

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