SEMI International Standards
Standards Locale: North America
Committee: EHS
Place of Meeting: Moscone Center - San Francisco, CA
Date of Meeting: 07/13/2023
Meeting End Date: 07/13/2023
Recording SEMI Standards Staff: Kevin Nguyen
CER Posted to Web: 07/19/2023


Leadership Changes
None.

Committee Structure Changes
None.

Ballot Results

Document #
Document Title
TC Chapter Action
A&R Forms for Approved Ballots
6884ALine Item Revision to SEMI S2-0821, Environmental, Health, And Safety Guideline For Semiconductor Manufacturing Equipment Refer below
Line Item 1 - Delayed Revisions related to lifting equipment and hinged loads ( 5.2, 18.6, and 18.7)Failed and returned to TF for rework and reballot
7022Line Item Revisions to SEMI S30-0719E Safety Guideline For Use Of Energetic Materials In Semiconductor R&D And Manufacturing Processes (regarding heating of piping)Refer below
Line Item 1 - Enhancing guidance on overtemperature and undertemperature risk management.Passed as balloted
Line Item 2 - Adding, as 17.8.8, criteria specific to managing the risks of loss of heating downstream of process chambers.Passed as balloted
Line Item 3 - Improving the alignment of the Safety Guideline’s text with the Energetic Materials TF’s understanding of what criteria apply to which substancesPassed as balloted
7023Reapproval of SEMI S6-0618 Environmental, Health, and Safety Guideline for Exhaust Ventilation of Semiconductor Manufacturing EquipmentFailed and returned to TF for rework and reballot
SEMI S10-0423Safety Guideline for Risk Assessment and Risk Evaluation Process

(Unballoted editorial changes)

Passed.S10_ProceduralReview-EditorialChangeType2.pdfS10_ProceduralReview-EditorialChangeType2.pdf
Note 1: Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.

Note 2: Failed ballots and line items were returned to the originating task forces for re-work and re-balloting or abandoning.


Ratification Ballot Results

Document #
Document Title
ISC A&R Action
A&R Forms
R6831CRevision to SEMI S1-1015, Safety Guideline for Equipment Safety LabelsPassedR6831C_ProceduralReview.pdfR6831C_ProceduralReview.pdf
Note 1: Passed Ratification ballots will be submitted to SEMI publication for final processing.

Note 2: Failed Ratification ballots were returned to the originating task forces for re-work and re-balloting or abandoning.


Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities

#
Type
SC/TF/WG
Details
7108SNARFS1 Revision TFLine Item Revision to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (labels)
7109SNARFS10 Revision TFLine Item Revisions to SEMI S1, S2, S10, S14, and S30 (regarding risk to buildings/facilities)
Note 1: SNARFs and TFOFs are available for review on the SEMI Web site at:

http://downloads.semi.org/web/wstdsbal.nsf/TFOFSNARF

Authorized Ballots

#
When
TF
Details
6884BCycle 6 or 7-2023S2 Mechanical TFLine Item Revision to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Mechanical)
6888ACycle 6 or 7-2023S12 (Equipment Decon) Review TFRevision of SEMI S12, Environmental, Health and Safety Guideline for Manufacturing Equipment Decontamination
6907Cycle 6 or 7-2023S7 Revision TFRevision to SEMI S7, Safety Guideline for Evaluating Personnel and Evaluating Company Qualifications
7021Cycle 6 or 7-2023S2/S22 Revision TFLine Items Revisions of S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment, and S22 Safety Guideline for the Electrical Design of Semiconductor Manufacturing Equipment
7108Cycle 6 or 7-2023S1 Revision TFLine Item Revision to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (labels)
7109Cycle 6 or 7-2023S10 Revision TFLine Item Revisions to SEMI S1, S2, S10, S14, and S30 (regarding risk to buildings/facilities)
TBDCycle 6 or 7-2023Ergonomics TFRevision to SEMI S8, Safety Guideline for Ergonomics Engineering of Semiconductor Manufacturing Equipment
TBDCycle 6 or 7-2023S23 Global TFRevision to SEMI S23 Guide for Conservation of Energy, Utilities and Materials Used by Semiconductor Manufacturing Equipment


SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Abolished

#
TF
Title
6309Ergonomics TFLine Item Revision to S8-0915, Safety Guideline for Ergonomics Engineering of
Semiconductor Manufacturing Equipment
6943Ergonomics TFLine Item Revisions to SEMI S8, Safety Guideline for Ergonomics Engineering of Semiconductor Manufacturing Equipment
6981Ergonomics TFLine Item Revision to S8-0218, Safety Guideline for Ergonomics Engineering of
Semiconductor Manufacturing Equipment
6595Fire Protection TFLine Item Revision to SEMI S2 Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment (Adding Guidance for Materials of Construction Evaluation Related to Fire Risk Assessment)


Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting
November 9, 2023 9AM -3 PM Pacific at SEMI HQ, Milpitas, CA in conjunction with NA Fall Meetings 2023. Check www.semi.org/standards for the latest update