SEMI International Standards
Standards Locale: North America |
Committee: 3D Packaging and Integration |
Place of Meeting: SEMI Headquarters, Milpitas, California/USA |
Date of Meeting: 11/07/2019 |
Meeting End Date: 11/07/2019 |
|
Recording SEMI Standards Staff: Laura Nguyen |
CER Posted to Web: 11/21/2019 |
Leadership Changes
None.
Committee Structure Changes
None.
Ballot Results
Document # | Document Title | Committee Action | A&R Forms for Approved Ballots |
6555 | Reapproval of SEMI 3D9-0914, Guide for Describing Materials Properties for a 300 mm 3DS-IC Wafer Stack | Passed, as balloted | 6555_Ballot Review.pdf |
6556 | Reapproval of SEMI 3D10-0814, Guide to Describing Materials Properties for Intermediate Wafers for Use in a 300 mm 3DS-IC Wafer Stack | Passed, as balloted | 6556_Ballot Review.pdf |
6557 | Reapproval of SEMI 3D11-1214, Terminology for Through Glass Via and Blind Via in Glass Geometrical Metrology | Passed, as balloted | 6557_Ballot Review.pdf |
6558 | Reapproval of SEMI 3D12-0315, Guide for Measuring Flatness and Shape of Low Stiffness Wafers | Failed | [Ballot Results] Cycle 06-2019 3DP&I I&M_TFresponse.pdf |
#1: Passed ballots and line items will be submitted to the ISC Audit & Review Subcommittee for procedural review.
#2: Failed ballots and line items were returned to the originating task forces for re-work and re-balloting or abandoning.
Ratification Ballot Results
None.
Activities Approved by the GCS between meetings of TC Chapter meeting
# | Type | SC/TF/WG | Details |
6591 | SNARF | PLP Panel TF | Revision to SEMI 3D20-0719, Specification for Panel Substrate Characteristics for Panel Level Packaging (PLP) Applications
– TC Member Review took place between 09/27/2019-10/11/2019
– Approved by GCS on 10/22/2019 |
Authorized Activities
None.
Authorized Ballots
Listing of documents authorized by the Originating TC Chapter for Letter Ballot.
# | When | TF | Details |
6591 | Cycle 1 or 2-2020 | PLP Panel TF | Revision to SEMI 3D20-0719, Specification for Panel Substrate Characteristics for Panel Level Packaging (PLP) Applications |
SNARF(s) Granted a One-Year Extension
None.
SNARF(s) Cancelled
None.
Standard(s) to receive Inactive Status
None.
Special Announcements of the Committee (Workshops, Programs, etc.)
None.
Next Meeting
The next meeting is scheduled in conjunction with the NA Standards Spring 2020 Meetings at SEMI Headquarters in Milpitas, California, March 30-April 2, 2020. For more information, please visit the Standards Calendar at http://www.semi.org/standards.
Tentative Schedule:
Thursday, April 2
11:00-12:00 Joint 3DP&I Bonded Wafer Stacks (TF) and 3DP&I Inspection and Metrology (TF)
13:00-14:00 PLP Panel (TF)
14:00-16:00 3DP&I (C)
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