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Standards Locale: North America

Committee: 3D Packaging and Integration

Place of Meeting: Moscone Center, San Francisco, California/USA

Date of Meeting: 07/11/2019

Meeting End Date: 07/11/2019

Recording SEMI Standards Staff: Laura Nguyen

CER Posted to Web: 07/19/2019

WG/TF/SC/TC Name	Previous Leader	New Leader
3DP&I NA TC Chapter	Rich Allen (NIST)	Bill Kerr (Evergreen Enhancement)
Fan-Out Panel Level Packaging (FO-PLP) Panel TF		Timothy Kryman (Rudolph Technologies)

Document #	Document Title	Committee Action	A&R Forms for Approved Ballots
R6075A	New Standard: Guide for Describing Glass-Based Material for Use in 3DS-IC Process	Passed, A&R Cycle 6-2019	R6075A_Ballot Review_pass.pdf
R6332A	New Standard: Specification for Panel Substrate Characteristics for Panel Level Packaging (PLP) Applications, with title change to: Specification for Panel Characteristics for Panel Level Packaging (PLP) Applications	Passed, A&R Cycle 6-2019	R6332A_Ballot Review_pass.pdf
6175B	New Standard: Guide on Measurements of Openings and Vias in Glass	Passed, with editorial changes	6175B_Ballot Review.pdf
6511	Reapproval of SEMI 3D8-0514, Guide for Describing Silicon Wafers for Use as 300 mm Carrier Wafers in a 3DS-IC Temporary Bond-Debond (TBDB) Process	Failed
6513	Reapproval of SEMI G83-0912, Specification for Bar Code Marking of Product Packages	Failed

Ratification Ballot Results
None.

Activities Approved by the GCS between meetings of TC Chapter meeting
None.

Authorized Activities
Listing of all revised or new SNARF(s) approved by the Originating TC Chapter.

#	Type	SC/TF/WG	Details
-	TFOF	PLP Panel TF	Panel Level Packaging (PLP) Panel TF – Revision to TFOF: update TF name, charter and scope
6555	SNARF	NA 3DP&I Committee	Reapproval of SEMI 3D9-0914, Guide for Describing Materials Properties for a 300 mm 3DS-IC Wafer Stack – Authorized new SNARF
6556	SNARF	NA 3DP&I Committee	Reapproval of SEMI 3D10-0814, Guide to Describing Materials Properties for Intermediate Wafers for Use in a 300 mm 3DS-IC Wafer Stack – Authorized new SNARF
6557	SNARF	NA 3DP&I Committee	Reapproval of SEMI 3D11-1214, Terminology for Through Glass Via and Blind Via in Glass Geometrical Metrology – Authorized new SNARF
6558	SNARF	NA 3DP&I Committee	Reapproval of SEMI 3D12-0315, Guide for Measuring Flatness and Shape of Low Stiffness Wafers – Authorized new SNARF

Note 1: SNARFs and TFOFs are available for review on the SEMI Web site at:
http://downloads.semi.org/web/wstdsbal.nsf/TFOFSNARF

Authorized Ballots
Listing of documents authorized by the Originating TC Chapter for Letter Ballot.

#	When	TF	Details
6555	Cycle 6-2019	NA 3DP&I Committee	Reapproval of SEMI 3D9-0914, Guide for Describing Materials Properties for a 300 mm 3DS-IC Wafer Stack
6556	Cycle 6-2019	NA 3DP&I Committee	Reapproval of SEMI 3D10-0814, Guide to Describing Materials Properties for Intermediate Wafers for Use in a 300 mm 3DS-IC Wafer Stack
6557	Cycle 6-2019	NA 3DP&I Committee	Reapproval of SEMI 3D11-1214, Terminology for Through Glass Via and Blind Via in Glass Geometrical Metrology
6558	Cycle 6-2019	NA 3DP&I Committee	Reapproval of SEMI 3D12-0315, Guide for Measuring Flatness and Shape of Low Stiffness Wafers

SNARF(s) Granted a One-Year Extension
None.

SNARF(s) Cancelled
None.

Standard(s) to receive Inactive Status
None.

Special Announcements of the Committee (Workshops, Programs, etc.)
None.

Next Meeting

The next meeting is scheduled for Thursday, November 7, in conjunction with the NA Standards Fall 2019 Meetings at SEMI Headquarters in Milpitas, California. For more information, please visit the Standards Calendar at http://www.semi.org/standards.

Tentative Schedule:

Thursday, November 7
11:00-12:00 Joint 3DP&I Bonded Wafer Stacks (TF) and 3DP&I Inspection and Metrology (TF)
13:00-14:00 PLP Panel (TF)
14:00-16:00 TBD 3DP&I (C)

Note: Alternative to move to Wednesday AM