SEMI International Standards
TASK FORCE ORGANIZATION FORM (TFOF)
Date Prepared:
04/26/2018
Revised (if Applicable):
12/12/2018
Name of Task Force (TF):
Panel Level Packaging Panel FOUP Task Force
Global Technical Committee:
Physical Interfaces & Carriers
Originating Technical Committee Region:
Japan
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1. Charter:
(State the objective of the proposed TF.)
This TF will focus on the development on Panel FOUP and related physical interface standards for Panel Level Packaging utilizing existing SEMI 450mm standards.
The target panel size is assumed as follows;
- Width 500~650mm x Depth 500~650mm
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2. Scope:
(Define the specific activities that the TF will conduct.)
Develop the requirements for:
· Panel FOUP
· Equipment to Panel FOUP interfaces
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3. Formal linkages with TFs in other Regions/Locales:
(Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
Physical Interfaces & Carriers NA TC Chapter
3D Packaging & Integration (3DP&I) NA, JA and Taiwan TC Chapters
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4. Formation Date:
(TF formed on)
Task Force formed on:
04/26/2018
Task Force approved by Committee/GCS on:
04/26/2018
5. Comments
The TF name was changed from "Fan-Out Panel Level Packaging (FO-PLP) Panel FOUP Task Force" to "Panel Level Packaging Panel FOUP Task Force" at the TC Chapter meeting held on December 12, 2018.
