SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 08/11/2016Revised (if Applicable): 11/08/2016

Document Number: 6076
SNARF for: New Standard: Specification for Identification and Marking on Wafers and Wafer Stacks for 3DS-IC Applications

Originating Global Technical Committee: 3D Packaging and Integration
Originating TC Chapter: North America
Task Force (TF) in which work is to be carried out: 3DP&I Bonded Wafer Stacks Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)

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1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
Current wafer identification standards and wafer marking standards do not adequately address the needs of bonded wafer stacks. The ID markings (e.g., T7) may be removed during either backside thinning operations or edge-trim operations. The markings may also be rendered un-readable by optical readers when bonded or buried under an opaque layer of silicon or other material. In addition, wafer stacks will combine wafers with multiple process histories, including mounting on temporary carrier wafers.

A standard is needed to combine and to track bonded wafer stacks with multiple wafer histories and/or ID markings.



b. Estimate effect on industry.
2: Major effect on an industry sector - identify the relevant sector
Sector or Company Information:

c. Estimate technical difficulty of the activity.
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible

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2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
Develop an identification standard that will meet the needs of bonded wafer stacks. The initial focus will be temporary bonding and permanent bonding as driven by contributions.

b: Expected result of activity
New Standard or Safety Guideline (including replacement of an existing Standard or Safety Guideline)

For a new Subordinate Standard, identify the Primary Standard here:




For Standards, identify the Standard Subtype below:
Specification

Miscellaneous (describe below):

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3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 07/11/2016b. 1st Draft by: 04/04/2017
c. (Optional) Informational Ballot by: d. Letter Ballot by: 10/01/2017
e. TC Chapter Approval By:11/01/2017

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4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
a.
List SEMI global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters and scopes as needed.)
Silicon Wafer
Traceability

b. List any planned Type I Liaisons with external nonprofit organizations (e.g., SDO) that should receive Draft Documents from Standards staff for feedback during this activity and be notified when the Letter Ballot is issued (refer to Procedure Manual § 7):


c. Intercommittee Ballots:
will be issued – identify the recipient global technical committee(s):

Identify the recipient global technical committee(s):
Silicon Wafer, Traceability
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5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

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6. Intellectual Property Considerations:
a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:
the use of patented technology is NOT required.

If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:


b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):
there is no known material patented technology necessary to use or implement the Standard(s) and Safety Guideline(s)

c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:
will NOT include reproduced copyrighted material



NOTE FORthe use of patented technology or the incorporation of Copyrighted Item(s) is NOT required’: If in the course of developing the Document, it is determined that the use of patented technology or Copyrighted Item(s) is necessary for the Document, the provisions of Regulations § 16 must be followed.

NOTE FORwill incorporate Copyrighted Item’: A copyright release letter must be obtained from the copyright owner prior to publication.

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7. Comments, Special Circumstances:
Original SNARF 7/12/2016
TC Member review took place 07/20/2016-08/03/2016, GCS approval on 08/11/2016

Revision SNARF for title change, dated 11/08/2016, TC Member review took place 11/17/2016-12/01/2016, GCS approval on 12/09/2016

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Proposal to transform 3DS-IC and Assembly & Packaging Committees into a single, unified global technical committee (GTC) was approved at the International Standards Committee meeting held on July 13, 2017 during SEMICON West.

Proposal Details:
To transform the 3DS-IC GTC and the Assembly & Packaging GTC into a Unified GTC
To name the transformed GTCs as "3D Packaging and Integration" GTC
Each TC chapter of the unified GTC will inherit the co-chairs of the existing TC chapters

All records were moved to the new 3D Packaging and Integration GTC.
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NA request JA to take over. Chie sent email 2018.07.23 reporting that JA does not want to take over the activity and is okay with NA abandoning SNARF.

During NA Fall Meetings 2018, a motion was made to abandon SNARF 6076.


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8. TC Member Review:
took place between (put dates below) before approval by the GCS, or

Member Review Start Date; 11/17/2016
Member Review End Date: 12/01/2016

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (Refer to Regulations ¶ 8.2.1)
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9. SNARF Approval Dates:
TC Chapter or GCS08/11/2016
Recorded in TC Minutes11/08/2016

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10. SNARF Extension Dates:
TC Chapter Extension Granted on
Extension Expires on
SNARF Revision 6076.docSNARF Revision 6076.doc