SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 11/04/2014Revised (if Applicable):

Document Number: 5823
SNARF for: Revision to SEMI 3D2, Specification for Glass Carrier Wafers for 3DS-IC Applications

Originating Global Technical Committee: 3DS-IC
Originating TC Chapter: North America
Task Force (TF) in which work is to be carried out: 3DS-IC Bonded Wafer Stacks
Note: If a new task force is needed, also submit a task force organization form (TFOF)

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1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
SEMI 3D2-1113 was originally developed to provide the framework for ordering Glass Wafers for the application of carrier wafer for processing device wafers for 3D stacking. As this technology has matured, the requirements for such carrier wafers have become more clear and weaknesses in 3D2-1113 have been identified.
This activity aims to revise SEMI 3D2-1113 to address the following weaknesses:
1. Update or eliminate specifications that are unnecessarily stringent for 3D stacked applications
2. Allow for additional glass types that were not permitted in 3D2-1113, yet meet industry requirements for 3D stacked applications.

This Document development activity is expected to result in a major revision of 3D2.


b. Estimate effect on industry.
2: Major effect on an industry sector - identify the relevant sector
Sector or Company Information:

c. Estimate technical difficulty of the activity.
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible

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2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
Table 1 of 3D2 is a template for ordering glass carrier wafers for 3DS-IC applications. Most entries currently have “suggested” values, with optional “other” values. Each entry will be evaluated to see if the current suggested value either:
1. No longer represent current industry requirements
2. Favor a particular technology or supplier.

This Draft document will address entries that fail one or both of these tests and will, as needed modify the definitions in section 7 to reflect these changes.

b: Expected result of activity
Major revision to an existing Standard or Safety Guideline

For a new Subordinate Standard, identify the Primary Standard here:




For Standards, identify the Standard Subtype below:


Miscellaneous (describe below):

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3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 11/01/2014b. 1st Draft by: 01/01/2015
c. (Optional) Informational Ballot by: d. Letter Ballot by: 02/01/2015
e. TC Chapter Approval By:04/01/2015

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4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
a. List SEMI global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters and scopes as needed.)
Global 3DS-IC
Japan Packaging Committee

Intercommittee Ballots will be issued: Packaging

b. List any planned Type I Liaisons with external nonprofit organizations (e.g., SDO) that should receive Draft Documents from Standards staff for feedback during this activity and be notified when the Letter Ballot is issued (refer to Procedure Manual § 7):


c. Intercommittee Ballots:


Identify the recipient global technical committee(s):

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5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

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6. Intellectual Property Considerations:
Note: Both a: and b: below should be checked for Revision of existing Standard(s) and Safety Guideline(s).

a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:


If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:


b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):


c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:



NOTE FOR ‘the use of patented technology or the incorporation of Copyrighted Item(s) is NOT required’: If in the course of developing the Document, it is determined that the use of patented technology or Copyrighted Item(s) is necessary for the Document, the provisions of Regulations § 16 must be followed.

NOTE FOR ’will incorporate Copyrighted Item’: A copyright release letter must be obtained from the copyright owner prior to publication.

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7. Comments, Special Circumstances:
None.

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8. TC Member Review:


Member Review Start Date; None.
Member Review End Date: None.

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (Refer to Regulations ¶ 8.2.1)
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9. SNARF Approval Dates:
TC Chapter or GCS11/04/2014
Recorded in TC Minutes11/04/2014

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10. SNARF Extension Dates:
TC Chapter Extension Granted on
Extension Expires on