SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 05/10/2016Revised (if Applicable):

Document Number: 6072
SNARF for: Revision of SEMI PV29-0212, Specification for Front Surface Marking of PV Silicon Wafers with Two-Dimensional Matrix Symbols

Originating Global Technical Committee: Photovoltaic (PV) - Materials
Originating TC Chapter: China
Task Force (TF) in which work is to be carried out: PV Silicon Wafer Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)

___________________________________________________________________________
1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
Solar PV electricity generation, as a sustainable alternative for conventional energy sources, has enjoyed tremendous development in the past few years. PV wafers are the fundamental material for solar cell and module production. Over 9 billion wafers are consumed annually. Thus, the silicon wafer manufacturing technology is of vital importance to PV industry.
During the lean production and the R&D process of PV silicon wafers, distinguishing different wafers is an essential step. Due to differences in raw materials and furnaces during actual PV production, variances among produced silicon ingots/bricks are inevitable, so it is with the quality of wafers from different locations of the same ingot. The existence of marks enables tracing back the production facilities and technologies from PV products, and piloting the optimization and improvement of PV equipment and technologies based on product performances feedback. Lean PV production has become a trend currently, of which the identification of wafers from different parts or of different properties is a prerequisite. In order to identify wafers of different characteristics, laser marking has been a regular and efficacious method in the evolution of silicon wafer technology.
In the lean production and the development of solar cell silicon wafers, each silicon wafer will go through processes of etching, texturing, film coating passivation, etc., which requires certain criteria for wafer identification. A too deep mark on the wafer will affect defect density and mechanical strength of the wafer, and a too shallow mark will be removed in the subsequent processes. Thus to mark the wafers without any interference with the performance is a fundamental requirement for wafer identification. Typical laser marking can identify the wafers but usually results in wafer fractures and performance losses. These interferences will seriously affect the making of wafer marks in the lean production and the pace of wafer technology development. This standard mainly sets normalized criteria for identification by laser marking to eliminate impacts on wafer performance of the identification process, and accelerate the development of PV technology and the lean wafer production. This standard is very much necessary to the PV technology development and lean PV production.



b. Estimate effect on industry.
1: Major effect on entire industry or on multiple important industry sectors - identify the relevant sectors
Sector or Company Information: Wafers slicing, solar cell manufacture, Module manufacture, PV System manufacture

c. Estimate technical difficulty of the activity.
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible

___________________________________________________________________________
2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
This standard is modified an existing SEMI PV29-0212 standard.
This standard is suitable for the tracking and identification of photovoltaic monocrystalline and polycrystalline silicon wafers.
This standard mainly includes the following technical contents:
1. Adjustment the postion of two-Dimensional Matrix Symbols.
2. Adding a new alphanumeric identifer. It’s convenient for worker to distinguish.
3. Requirements and criteria of the depth and the location of the identifier.


b: Expected result of activity
Major revision to an existing Standard or Safety Guideline

For a new Subordinate Standard, identify the Primary Standard here:


Modification of an existing part of Standard(s) or Safety Guideline(s) including Appendices, Complementary Files, and Supplementary Materials, Addition of one or more Appendices or Complementary Files to an existing Standard or Safety Guideline

For Standards, identify the Standard Subtype below:
Specification

Miscellaneous (describe below):

___________________________________________________________________________
3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 05/01/2016b. 1st Draft by: 03/01/2017
c. (Optional) Informational Ballot by: d. Letter Ballot by: 08/01/2017
e. TC Chapter Approval By:02/01/2018

_____________________________________________________________________________
4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
a.
List SEMI global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters and scopes as needed.)


b. List any planned Type I Liaisons with external nonprofit organizations (e.g., SDO) that should receive Draft Documents from Standards staff for feedback during this activity and be notified when the Letter Ballot is issued (refer to Procedure Manual § 7):


c. Intercommittee Ballots:
will be issued – identify the recipient global technical committee(s):

Identify the recipient global technical committee(s):
Photovoltaic (PV) - Materials
___________________________________________________________________________
5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

___________________________________________________________________________
6. Intellectual Property Considerations:
Note: Both a: and b: below should be checked for Revision of existing Standard(s) and Safety Guideline(s).

a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:
the use of patented technology is NOT required.

If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:


b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):
there is no known material patented technology necessary to use or implement the Standard(s) and Safety Guideline(s)

c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:
will NOT include reproduced copyrighted material



NOTE FORthe use of patented technology or the incorporation of Copyrighted Item(s) is NOT required’: If in the course of developing the Document, it is determined that the use of patented technology or Copyrighted Item(s) is necessary for the Document, the provisions of Regulations § 16 must be followed.

NOTE FORwill incorporate Copyrighted Item’: A copyright release letter must be obtained from the copyright owner prior to publication.

___________________________________________________________________________
7. Comments, Special Circumstances:
Efforts to form a PV Materials TC Chapter in China are underway. When formation is approved, the new China PV Materials TC Chapter will be home to the PV Silicon Wafer TF and PV Silicon Raw Materials TF (which currently belong to the China PV TC Chapter.

__________________________________________________________________________
8. TC Member Review:
took place between (put dates below ) before approval at the TC Chapter Meeting, or

Member Review Start Date; 6/27/2016
Member Review End Date: 7/11/2016

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (Refer to Regulations ¶ 8.2.1)
__________________________________________________________________________

9. SNARF Approval Dates:
TC Chapter or GCS07/29/2016
Recorded in TC Minutes08/15/2016

__________________________________________________________________________

10. SNARF Extension Dates:
TC Chapter Extension Granted on
Extension Expires on
Revision of SEMI PV29-0212, Specification for Front Surface Marking of PV Silicon Wafers with Two-Dimensional Matrix Symbols 改.doc