SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 11/08/2017Revised (if Applicable):

Document Number: 6311
SNARF for: New Standard: Specification for TEM Lamella Carrier Used in Electron Microscopy Workflows

Originating Global Technical Committee: Physical Interfaces & Carriers
Originating TC Chapter: North America
Task Force (TF) in which work is to be carried out: Electron Microscopy Workflow Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)

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1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
The use of transmission electron microscopes (TEM) in manufacturing labs and fabs for semiconductor devices is rapidly growing for process and quality control. This requires fast, automated and easy-to-use operation of all equipment used for preparing the samples and measuring them. Tools used for this include FIB (focused ion beam), SEM (scanning electron microscope), plasma cleaner, storage units and TEM. The samples prepared – called lamellas – are mounted on so-called grids that are transported several times between the different tools involved in the course of the investigation. The transport is so far performed manually with a non-zero failure rate and is a slow process not compatible with an automated operation. Proprietary solutions for lamella carriers might improve this, but would prohibit the users to combine tools from different microscopy suppliers for optimizing their processes and yields.

Therefore, standardizing the lamella carriers regarding their form factor, geometric dimensions and materials used would allow mixing equipment from different suppliers and would benefit all involved parties.



b. Estimate effect on industry.
2: Major effect on an industry sector - identify the relevant sector
Sector or Company Information: Suppliers and users of FIB, SEM, TEM, lamella carriers (“TEM grids”), cleaning and storing equipment.

c. Estimate technical difficulty of the activity.
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible

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2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
The new standard will specify the form factor and the geometrical dimensions of the lamella carriers used for TEM investigations. The new standard will also specify physical features related to the storage, handling, transport and identification of the lamella carriers (e.g. fiducials for alignment, carrier id location, exclusion areas for handling, etc.)

b: Expected result of activity
New Standard or Safety Guideline (including replacement of an existing Standard or Safety Guideline)

For a new Subordinate Standard, identify the Primary Standard here:




For Standards, identify the Standard Subtype below:
Specification

Miscellaneous (describe below):

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3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 11/07/2017b. 1st Draft by: 03/01/2018
c. (Optional) Informational Ballot by: d. Letter Ballot by: 07/01/2018
e. TC Chapter Approval By:11/07/2018

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4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
a. List SEMI global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters and scopes as needed.)
Compound Semiconductor GTC
3D Packaging & Integration GTC
Silicon Wafer GTC

b. List any planned Type I Liaisons with external nonprofit organizations (e.g., SDO) that should receive Draft Documents from Standards staff for feedback during this activity and be notified when the Letter Ballot is issued (refer to Procedure Manual § 7):


c. Intercommittee Ballots:
will be issued – identify the recipient global technical committee(s):

Identify the recipient global technical committee(s):
3D Packaging and Integration, Compound Semiconductor Materials, Silicon Wafer
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5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

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6. Intellectual Property Considerations:
Note: Both a: and b: below should be checked for Revision of existing Standard(s) and Safety Guideline(s).

a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:
the use of patented technology is NOT required.

If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:


b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):


c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:



NOTE FOR ‘the use of patented technology or the incorporation of Copyrighted Item(s) is NOT required’: If in the course of developing the Document, it is determined that the use of patented technology or Copyrighted Item(s) is necessary for the Document, the provisions of Regulations § 16 must be followed.

NOTE FOR ’will incorporate Copyrighted Item’: A copyright release letter must be obtained from the copyright owner prior to publication.

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7. Comments, Special Circumstances:
None.

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8. TC Member Review:
took place between (put dates below ) before approval at the TC Chapter Meeting, or

Member Review Start Date; 10/13/2017
Member Review End Date: 10/27/2017

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (Refer to Regulations ¶ 8.2.1)
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9. SNARF Approval Dates:
TC Chapter or GCS11/08/2017
Recorded in TC Minutes11/08/2017

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10. SNARF Extension Dates:
TC Chapter Extension Granted on
Extension Expires on
SNARF_ElectronMicroscopyTaskForce_08Nov2017.docSNARF_ElectronMicroscopyTaskForce_08Nov2017.doc