SEMI International Standards
Date Prepared: 03/31/2011Revised (if Applicable):

Name of Task Force (TF): Building Information Modeling (BIM) for Semiconductor Capital Equipment Task Force

Global Technical Committee: Facilities
Originating Technical Committee Region: North America

1. Charter: (State the objective of the proposed TF.)
Semiconductor manufacturers are asking equipment suppliers to provide input for Building Information Modeling (BIM) software and the industry needs a standard format that will work with multiple different software applications (there are at least three software companies that work in this space). This is the latest trend in facilities planning. Basically, it is a 3D model (shell only) of a piece of capital equipment with interconnect information (water, power, gas, exhaust, etc) defined in the model. The model needs to reflect the true dimensions of the tool and show the x, y, and z location of each interface point. It is also expected to contain information about idle, typical, and maximum usage of each interface point similar to what is currently defined in SEMI E6. This allows the user to build virtual models of their entire fab, optimize layouts, and plan all of the facilities requirements (routing and sizing of all of the equipment supplies). The benefit of BIM to the semiconductor manufacturers is large when designing new fabs or optimizing existing fabs and this effort is being driven by some of the largest semiconductor companies. With a common format that works for all semiconductor manufacturers and all BIM software, the equipment manufacturers will only have to create one BIM model per equipment configuration. It can take several hundred man hours to build such a model and this would become impractical without a common format.
2. Scope: (Define the specific activities that the TF will conduct.)
1. This Guide would be applicable to all semiconductor wafer processing equipment (i.e. deposition, etch, inspection, track, implant, etc).
2. The Guide would define a digital format that can be easily exported from a wide array of 3D modeling programs and imported into any of the BIM software packages.
3. The Guide would define a set of required interconnects with defined location tolerances, defined features, and defined terminology.
4. The Guide will define a set of required support data for each interconnect point (ie idle, typical, max consumption).

3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)

4. Formation Date:(TF formed on)

Task Force formed on: 03/29/2011
Task Force approved by Committee/GCS on: 03/29/2011