SEMI International Standards
SEMI New Activity Report Form (SNARF)

Activity Number: 5430
SNARF for: Revision to SEMI M73-0309 Test Methods for Extracting Relevent Characteristics from Measured Wafer Edge Profiles

Originating Global Technical Committee: Silicon Wafer
Originating Technical Committee Region: Europe
Task Force in which work is to be carried out: International Advanced Wafer Geometry Task Force

1. Rationale: SEMI M73 does not explicitly refer to the Si wafer diameter, but it was written with respect to 300 mm wafers. It needs to be updated so that it includes also 450 mm wafers, in particular the values for apex length in Tab. 3 of M73.
Rate the Estimated Effect on the Industry
2: Major effect on an industry sector - identify the relevant sector

Rate the Estimated Technical Difficulty of the Activity
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible

2. Scope:
a: Define the areas to be covered or addressed by this activity or document:
Modify SEMI M73, Tab. 3 and elsewhere in the document where necessary, so that it includes 450 mm wafers. Change text correspondingly where needed.

b: Expected result of activity
Revision to an existing Standard/Guideline

3. Projected Timetable for Completion:
a: General Milestones
a. Activity Start: 05/01/2012b. 1st Draft by: 07/12/2012
c. Preballot by: d. Technical Ballot by: 07/01/2012
e. Committee Approval By:10/01/2012

Safety Considerations:
The resulting document is expected NOT to be a Safety Guideline

Intellectual Property Considerations:
a. In complying with the standard or safety guideline to be developed, the use of patented technology or a copyrighted item(s) is NOT required
b. The body of the standard and any appendices or related information sections will NOT include copyrighted material

Comments, Special Circumstances: None.

Approval: Activity approved by Committee/GCS on May 24, 2012