SEMI International Standards
SEMI New Activity Report Form (SNARF)

Activity Number: 5175
SNARF for: New Standard: Guide for Multi-Wafer Transport and Storage Containers for Thin Wafers

Originating Global Technical Committee: 3DS-IC
Originating Technical Committee Region: North America
Task Force in which work is to be carried out: 3DS-IC Thin Wafer Handling

1. Rationale: Current standards for wafer transport and storage containers (shipping boxes, FOUP, FOSBs) do not adequately address the reliable storage and tranportation of thin wafers and dice on tape frame used in 3DS-IC manufacturing. Wafer thicknesses of 30-200um will need significant changes to the current design criteria of current wafer transport and storage containers. This will address robust handling and shipping of thin wafers, including changes in securing the wafers. New inspection processes will be addressed in the Inspection and Metrology TF.
Rate the Estimated Effect on the Industry
2: Major effect on an industry sector - identify the relevant sector

Rate the Estimated Technical Difficulty of the Activity
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible

2. Scope:
a: Define the areas to be covered or addressed by this activity or document:
Develop a thin wafer handling and shipping guide that will meet the needs of 3DS-IC manufacturing.

* Standards for tape frame
* Standards for thin wafer on tape frame
* Requirements of capacity of containers
* Transportation/vibration and mechanical shock requirements

b: Expected result of activity
New Standard

3. Projected Timetable for Completion:
a: General Milestones
a. Activity Start: 03/29/2011b. 1st Draft by: 08/30/2011
c. Preballot by: d. Technical Ballot by: 09/12/2011
e. Committee Approval By:10/25/2011

Safety Considerations:
The resulting document is expected NOT to be a Safety Guideline

Intellectual Property Considerations:
a. In complying with the standard or safety guideline to be developed, the use of patented technology or a copyrighted item(s) is NOT required
b. The body of the standard and any appendices or related information sections will NOT include copyrighted material

Comments, Special Circumstances: None.

Approval: Activity approved by Committee/GCS on March 29, 2011