SEMI International Standards
SEMI New Activity Report Form (SNARF)



Activity Number: 5251
SNARF for: Revision of SEMI M1, Specifications for Polished Single Crystal Silicon Wafers (Re:Addition of node-specific guides)


Originating Global Technical Committee: Silicon Wafer
Originating Technical Committee Region: North America
Task Force in which work is to be carried out: International Polished Wafers Task Force


1. Rationale: At prersent there is no technology node-specific parameter guidance for polished wafers as there is for EPI wafers (M62 Related Information). Such guides are needed to rapid adoption and standardization of wafers for new technology generations. Although the impetus for this effort is the 450mm diameter transition, the guides will not be diameter-specific.
Rate the Estimated Effect on the Industry
1: Major effect on entire industry or on multiple important industry sectors

Rate the Estimated Technical Difficulty of the Activity
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible

2. Scope:
a: Define the areas to be covered or addressed by this activity or document:
Wafer specification, polished wafers.

b: Expected result of activity
Revision to an existing Standard/Guideline

3. Projected Timetable for Completion:
a: General Milestones
a. Activity Start: 07/01/2011b. 1st Draft by: 10/01/2011
c. Preballot by: d. Technical Ballot by: 12/01/2011
e. Committee Approval By:08/01/2012




Safety Considerations:
The resulting document is expected NOT to be a Safety Guideline


Intellectual Property Considerations:
a. In complying with the standard or safety guideline to be developed, there is no alternative to the use of patented technology or copyrighted item(s)
b. The body of the standard and any appendices or related information sections will NOT include copyrighted material

Comments, Special Circumstances: None.

Approval: Activity approved by Committee/GCS on July 13, 2011