SEMI International Standards
TASK FORCE ORGANIZATION FORM (TFOF)
Date Prepared:
01/24/2024
Revised (if Applicable):
Name of Task Force (TF):
Wafer Bond Strength Measurement by Double-cantilever Beam Task Force
Global Technical Committee:
3D Packaging and Integration
Originating Technical Committee Region:
Japan
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1. Charter:
(State the objective of the proposed TF.)
The wafer bonding process is maturing and being utilized for a wide variety of semiconductor processes. Bonding is typically assessed through "adherence energy (also known as bond strength)," with the energy evaluated using the double cantilever beam (DCB) test. While this test is widely used in the semiconductor field, there is currently no standardized method for measurement. As a result, measured values exhibit significant variation even within a wafer. Furthermore, these values are not comparable. The objective of the task force is to minimize this variation and establish an industrial standard for bond strength measurement as well as the values for process qualification.
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2. Scope:
(Define the specific activities that the TF will conduct.)
Discuss the most robust bond strength measurement method, primarily for 300 mm wafers, for use in semiconductor manufacturing.
Standardize key factors such as
· wafer positioning
· environmental conditions
· blade
· insertion condition
· measurement location based on an obtained images
among others.
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3. Formal linkages with TFs in other Regions/Locales:
(Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
None
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4. Formation Date:
(TF formed on)
Task Force formed on:
01/26/2024
Task Force approved by Committee/GCS on:
01/26/2024
5. Comments
None.
