SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 06/26/2009Revised (if Applicable): 07/16/2009

Document Number: 4770
SNARF for: 450mm Horizontal Multi Application Carrier Standard (450 H-MAC)

Originating Global Technical Committee: Physical Interfaces & Carriers
Originating TC Chapter: North America
Task Force (TF) in which work is to be carried out: NA 450mm Shipping Box Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)

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1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
There is a need by multiple end users in the Semiconductor industry for a carrier which can address various applications that already exist in the industry for 300mm wafer manufacturing and wafer shipping. To full fill this need the carrier shall enable factory integration compatibility with 450 FOUP thus minimizing impact to Tools, Load Port & EFEM, AMHS and manufacturing environment/facilities and yet efficient.


b. Estimate effect on industry.
1: Major effect on entire industry or on multiple important industry sectors
Sector or Company Information:

c. Estimate technical difficulty of the activity.
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible

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2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
Leverage 4570A FOUP standard document as the frame work. 450 H-MAC shall have the same envelope, factory integration and interoperability interfaces as the 450 FOUP while delivering the needs of the multiple applications. 450 H-MAC is an E-series NA PIC Standard.

Note: H-MAC is a perimeter wafer support carrier and enables random access in the same envelope as the FOUP

The H-MAC is focused on Silicon Manufacturing and Processed Wafer Shipping.


b: Expected result of activity
New Standard

For a new Subordinate Standard, identify the Primary Standard here:




For Standards, identify the Standard Subtype below:


Miscellaneous (describe below):

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3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 06/26/2009b. 1st Draft by: 07/06/2009
c. (Optional) Informational Ballot by: 07/17/2009d. Letter Ballot by: 10/05/2009
e. TC Chapter Approval By:04/01/2010

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4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
a.
List global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters as needed.)
450mm Handling Wafer TF
450mm IPIC TF
Global Silicon Wafer Committee

b. Intercommittee Ballots:


Identify the recipient global technical committee(s):

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5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 14.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

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6. Intellectual Property Considerations:
a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:


If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:


b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):


c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:



NOTE FOR "the use of patented technology or a copyrighted item(s) is NOT required": If in the course of developing the document, it is determined that patented technology or copyrighted item(s) must be used to comply with the standard or safety guideline, the provisions of Section 15 of the Regulations must be followed.)

NOTE FOR "will include reproduced copyrighted material": A copyright release letter must be obtained from the copyright owner.

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7. Comments, Special Circumstances:
Intellectual Property Considerations:
Patent and/or patent applications material to this Standards draft document is unknown. Once the task force has determined that there is no alternative to the use of patented technology or copyrighted item(s), this SNARF will be revised then reapproved by the committee and the Global Coordinating Subcommittee (GCS).


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8. TC Member Review:
None.

Member Review Start Date; None.
Member Review End Date: None.

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (See Regulations 8.2.1)
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9.. SNARF Approval Dates:
TC Chapter or GCS07/16/2009
Recorded in TC Minutes
Attach Pictures and Files here: