SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 03/31/2011Revised (if Applicable):

Document Number: 5155
SNARF for: New Standard: Guide for Building Information Modeling (BIM) for Semiconductor Capital Equipment

Originating Global Technical Committee: Facilities
Originating TC Chapter: North America
Task Force (TF) in which work is to be carried out: Building Information Modeling (BIM) for Semiconductor Capital Equipment Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)

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1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
Semiconductor manufacturers are asking equipment suppliers to provide input for Building Information Modeling (BIM) software and the industry needs a standard format that will work with multiple different software applications (there are at least three software companies that work in this space). This is the latest trend in facilities planning. Basically, it is a 3D model (shell only) of a piece of capital equipment with interconnect information (water, power, gas, exhaust, etc) defined in the model. The model needs to reflect the true dimensions of the tool and show the x, y, and z location of each interface point. It is also expected to contain information about idle, typical, and maximum usage of each interface point similar to what is currently defined in SEMI E6. This allows the user to build virtual models of their entire fab, optimize layouts, and plan all of the facilities requirements (routing and sizing of all of the equipment supplies). The benefit of BIM to the semiconductor manufacturers is large when designing new fabs or optimizing existing fabs and this effort is being driven by some of the largest semiconductor companies. With a common format that works for all semiconductor manufacturers and all BIM software, the equipment manufacturers will only have to create one BIM model per equipment configuration. It can take several hundred man hours to build such a model and this would become impractical without a common format.


b. Estimate effect on industry.
2: Major effect on an industry sector - identify the relevant sector
Sector or Company Information: Equipment manufacturers

c. Estimate technical difficulty of the activity.
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible

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2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
1. This Guide would be applicable to all semiconductor wafer processing equipment (i.e. deposition, etch, inspection, track, implant, etc).
2. The Guide would define a digital format that can be easily exported from a wide array of 3D modeling programs and imported into any of the BIM software packages.
3. The Guide would define a set of required interconnects with defined location tolerances, defined features, and defined terminology.
4. The Guide will define a set of required support data for each interconnect point (ie idle, typical, max consumption).


b: Expected result of activity
New Standard

For a new Subordinate Standard, identify the Primary Standard here:




For Standards, identify the Standard Subtype below:


Miscellaneous (describe below):

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3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 03/01/2011b. 1st Draft by: 07/01/2011
c. (Optional) Informational Ballot by: d. Letter Ballot by: 11/01/2011
e. TC Chapter Approval By:03/01/2012

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4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
a.
List global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters as needed.)
I&C Committee

b. Intercommittee Ballots:


Identify the recipient global technical committee(s):

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5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

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6. Intellectual Property Considerations:
a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:
the use of patented technology or a copyrighted item(s) is NOT required

If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:


b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):


c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:
will NOT include copyrighted material



NOTE FOR "the use of patented technology or a copyrighted item(s) is NOT required": If in the course of developing the document, it is determined that patented technology or copyrighted item(s) must be used to comply with the standard or safety guideline, the provisions of Section 16 of the Regulations must be followed.)

NOTE FOR "will include reproduced copyrighted material": A copyright release letter must be obtained from the copyright owner.

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7. Comments, Special Circumstances:
None.

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8. TC Member Review:
None.

Member Review Start Date; None.
Member Review End Date: None.

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (See Regulations 8.2.1)
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9.. SNARF Approval Dates:
TC Chapter or GCS03/29/2011
Recorded in TC Minutes
Attach Pictures and Files here: