SEMI International Standards
TASK FORCE ORGANIZATION FORM (TFOF)
Date Prepared: 12/21/2010Revised (if Applicable):

Name of Task Force (TF): HB-LED Equipment Automation Interfaces

Global Technical Committee: HB-LED
Originating Technical Committee Region: North America


_____________________________________________________________________________
1. Charter: (State the objective of the proposed TF.)
* Define physical interfaces of substrate carriers used in HB-LED manufacturing.
* Define physical interfaces of process and metrology tools and of wafer / substrate carriers used in HB-LED manufacturing.
* This task force will sponsor forums to bring stakeholders together to define the wafer/substrate characteristics required for wafer/substrate handling wafers, substrate carriers, HB-LED process interactions, and metrology interfaces.

_____________________________________________________________________________
2. Scope: (Define the specific activities that the TF will conduct.)
This effort will require some initial discussions around a common vision for an HB-LED factory to which these standards shall apply. I don’t believe that a common Automation Vision should be a required output of this task force. Although, the standards process would benefit greatly from any level of consensus in this area.

Carrier-related activities:
Start with 150 mm diameter wafers. Include:
* Shipping carriers –
- from wafer supplier to epi processor, and
- from epi processor to front-end HB-LED device fab

* Automation carriers –
- Process tool input and output
- Factory automation interfaces
- Robotic handling interfaces

* Process carriers
- Liquid, gaseous and vacuum environment

Issues:
- Wafer diameter
- Wafer thickness
- Wafer flat
- Wafer Capacity.
- Wafer Bow > 1mm
- Slot pitch and related dimensions
- Equipment interface
- ID – Traceablity
- Contamination Control

Automation-related activities:
Start with 150 mm diameter wafers tools. Include shipping system, and physical interfaces for
* Process and Metrology Tools
End Effectors
Tool-to-carrier interfaces

* Substrate Carriers
- Shipping carriers
from wafer supplier to epi processor, and
from epi processor to front-end HB-LED device fab
- Automation carriers
Process tool input and output
Factory automation interfaces
Robotic handling interfaces
- Process carriers
Liquid, gaseous and vacuum environment

Issues
- Wafer diameter, thickness
- Rectangular substrate dimensions
- Wafer/Substrate Capacity
- Wafer Bow > 1mm
- Slot pitch and related dimensions
- Equipment interface
- ID – Traceability
- Contamination Control

_____________________________________________________________________________
3. Formal linkages with TFs in other Regions/Locales: (Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
Global PIC Committee
Global Traceability Committee
Global Information & Control

_____________________________________________________________________________
4. Formation Date:(TF formed on)

Task Force formed on: 12/31/2010
Task Force approved by Committee/GCS on: