SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 06/30/2011Revised (if Applicable):

Document Number: 5269
SNARF for: New Standard: Guide for Terminology for Measured Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures

Originating Global Technical Committee: 3DS-IC
Originating TC Chapter: North America
Task Force (TF) in which work is to be carried out: 3DS-IC Inspection and Metrology
Note: If a new task force is needed, also submit a task force organization form (TFOF)

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1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
Different technologies can measure various geometrical parameters of an individual TSV, or of an array of TSV’s, such as pitch, top CD, top diameter, top area, depth, taper (or sidewall angle), bottom area, bottom CD, bottom diameter, and possibly others. However it is currently difficult to compare and/or correlate results from the various measurement technologies for various TSV dimensions. In some cases certain parameters may be described by similar names, but are actually different aspects of the TSV geometry. This standard will attempt to: a) Group the measurement results provided by the various technologies in such a way that correlations and comparisons are valid where possible; b) Clearly indicate the underlying issues in cases where valid comparisons and correlations are not geometrically valid.


b. Estimate effect on industry.
2: Major effect on an industry sector - identify the relevant sector
Sector or Company Information: 3DS-ICs

c. Estimate technical difficulty of the activity.
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible

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2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
Define terms currently used to describe TSV parameters which are not defined in current SEMI Standards, and list those that are already defined in current SEMI Standards. For each parameter (or group of parameters), the various technologies that are used will be listed, along with any limitations and/or issues and needs particular to that technology and to making valid comparisons to the others. Include applicable ranges for valid measurements where possible.

b: Expected result of activity
New Standard

For a new Subordinate Standard, identify the Primary Standard here:




For Standards, identify the Standard Subtype below:


Miscellaneous (describe below):

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3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 03/01/2011b. 1st Draft by: 10/25/2011
c. (Optional) Informational Ballot by: d. Letter Ballot by: 01/01/2012
e. TC Chapter Approval By:03/01/2012

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4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
a.
List global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters as needed.)
None

b. Intercommittee Ballots:


Identify the recipient global technical committee(s):

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5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 14.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

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6. Intellectual Property Considerations:
a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:
the use of patented technology or a copyrighted item(s) is NOT required

If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:


b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):


c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:
will NOT include copyrighted material



NOTE FOR "the use of patented technology or a copyrighted item(s) is NOT required": If in the course of developing the document, it is determined that patented technology or copyrighted item(s) must be used to comply with the standard or safety guideline, the provisions of Section 15 of the Regulations must be followed.)

NOTE FOR "will include reproduced copyrighted material": A copyright release letter must be obtained from the copyright owner.

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7. Comments, Special Circumstances:
None.

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8. TC Member Review:
None.

Member Review Start Date; None.
Member Review End Date: None.

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (See Regulations 8.2.1)
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9.. SNARF Approval Dates:
TC Chapter or GCS07/12/2011
Recorded in TC Minutes07/12/2011
Attach Pictures and Files here: