Activity Number: 5263
SNARF for: Revisions to SEMI E158-1110, Mechanical Specification for Fab Wafer Carrier Used to Transport and Store 450mm Wafers (450 FOUP) and Kinematic Coupling, and SEMI E159-0611, Mechanical Specification for Multi Application Carrier (MAC) Used to Transport and Ship 450mm Wafers
SEMI International Standards
SEMI New Activity Report Form (SNARF)
1. Rationale: Text and Table corrections presented within.
|Originating Global Technical Committee: Physical Interfaces & Carriers|
|Originating Technical Committee Region: North America|
|Task Force in which work is to be carried out: International 450 mm Physical Interfaces & Carriers|
Corresponding Figure corrections are either listed next to the table item or separately in slides for later correction.
Align both documents (E158 and E159)
Correct the frame pin hole interference
Rate the Estimated Effect on the Industry
3: Major effect on a few companies - identify the relevant companies
Rate the Estimated Technical Difficulty of the Activity
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible
a: Define the areas to be covered or addressed by this activity or document:
Line item 1. Change and add the “end effector” term in the Terminology section for E159(MAC).
Line item 2. Add explanation of the Center of Gravity Volume for E159(MAC).
Line item 3. Unify section.6 and table 1 with the term of the FOUP standard for E159(MAC)
Line item 4. Correction of some terms to facilitate understanding for E158(FOUP) and E159(MAC).
- Section 8.1.4, section 9.1, section 14.4 of FOUP, section 14.4 of MAC, section 17.6.3 of FOUP, section 17.7.3 of MAC and section R3-1.1.
Line item 5. Change the shape of frame pin hole for E158(FOUP) and E159(MAC).
b: Expected result of activity
Revision to an existing Standard/Safety Guideline
3. Projected Timetable for Completion:
|a: General Milestones|
|a. Activity Start: 07/12/2011||b. 1st Draft by: 08/29/2011|
|c. Preballot by: ||d. Technical Ballot by: 08/29/2011|
|e. Committee Approval By:10/26/2011|
The resulting document is expected NOT to be a Safety Guideline
Intellectual Property Considerations:
a. In complying with the standard or safety guideline to be developed,
b. The body of the standard and any appendices or related information sections
Comments, Special Circumstances: Existing IP considerations in E158 and E159
Approval: Activity approved by Committee/GCS on July 13, 2011
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