Activity Number: 5173
SNARF for: New Standard: Guide for Describing Silicon Wafers for Use in a 300 mm 3DS-IC Wafer Stack
SEMI International Standards
SEMI New Activity Report Form (SNARF)
1. Rationale: Current wafer standards (SEMI M1) do not adequately address the needs of wafers used in bonded wafer stacks. Recently, the Bonded Wafer Stack TF has been developing SEMI Draft Document 5173, which originally covered six independent topics, of which one was spun out, balloted, and published as SEMI 3D2-0113.
|Originating Global Technical Committee: 3DS-IC|
|Originating Technical Committee Region: North America|
|Task Force in which work is to be carried out: 3DS-IC Bonded Wafer Stacks|
The BWS TF has decided to split the remaining sections of 5173C into five separate documents. The outcome of this SNARF will be a document that addresses the needs for virgin silicon wafers for fabrication of circuits to be included in a 3D stack.
Rate the Estimated Effect on the Industry
1: Major effect on entire industry or on multiple important industry sectors
Rate the Estimated Technical Difficulty of the Activity
III: Difficult - Limited expertise and resources exist and/or achieving consensus difficult
a: Define the areas to be covered or addressed by this activity or document:
This standard will provide guidelines for the purchase of 300 mm silicon wafers for use as device wafers in 3DS-IC application by appropriate entries for the wafer ordering table in SEMI M1.
b: Expected result of activity
3. Projected Timetable for Completion:
|a: General Milestones|
|a. Activity Start: 03/29/2011||b. 1st Draft by: 12/01/2014|
|c. Preballot by: ||d. Technical Ballot by: 02/14/2014|
|e. Committee Approval By:04/01/2014|
The resulting document is expected NOT to be a Safety Guideline
Intellectual Property Considerations:
a. In complying with the standard or safety guideline to be developed, the use of patented technology or a copyrighted item(s) is NOT required
b. The body of the standard and any appendices or related information sections will NOT include copyrighted material
Comments, Special Circumstances: 5173 SNARF revised in late 2013, approved via 3DS-IC in February 10, 2014. 5173 was split into 5 more manageable activities.
Approval: Activity approved by Committee/GCS on March 29, 2011
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