SEMI International Standards
SEMI New Activity Report Form (SNARF)



Activity Number: 5173
SNARF for: New Standard: Specification for Parameters for Bonded Wafer Stacks


Originating Global Technical Committee: 3DS-IC
Originating Technical Committee Region: North America
Task Force in which work is to be carried out: 3DS-IC Bonded Wafer Stacks


1. Rationale: Current wafer standards (SEMI M1) do not adequately address the needs of wafers used in bonded wafer stacks. Wafer thickness, edge bevel, notch, mass, bow/warp and diameters are changed when wafer stacks are bonded together, or wafer stacks bonded and thinned. These deviations from wafer parameters specified in SEMI M1 have numerous impacts in other equipment and hardware standards that reference SEMI M1, and drives a new standard to reflect wafer parameters associated with bonded and bonded/thinned wafer stacks.
Rate the Estimated Effect on the Industry
2: Major effect on an industry sector - identify the relevant sector

Rate the Estimated Technical Difficulty of the Activity
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible

2. Scope:
a: Define the areas to be covered or addressed by this activity or document:
Develop a standard that will meet the needs of bonded wafer stacks using temporary bonding to carrier wafers. This standard will reflect the new parameters (including thickness, edge bevel, notch, mass, bow/warp and diameters, etc.) associated with bonded wafer stacks including bonded and thinned stacks.
This standard will include both Silicon and glass carrier wafers.

b: Expected result of activity
New Standard

3. Projected Timetable for Completion:
a: General Milestones
a. Activity Start: 03/29/2011b. 1st Draft by: 06/25/2011
c. Preballot by: d. Technical Ballot by: 08/08/2011
e. Committee Approval By:10/25/2011




Safety Considerations:
The resulting document is expected NOT to be a Safety Guideline


Intellectual Property Considerations:
a. In complying with the standard or safety guideline to be developed, the use of patented technology or a copyrighted item(s) is NOT required
b. The body of the standard and any appendices or related information sections will NOT include copyrighted material

Comments, Special Circumstances: None.

Approval: Activity approved by Committee/GCS on March 29, 2011