SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 03/25/2011Revised (if Applicable): 02/10/2014

Document Number: 5173
SNARF for: New Standard, Guide for Describing Silicon Wafers for Use in a 300 mm 3DS-IC Wafer Stack

Originating Global Technical Committee: 3D Packaging and Integration
Originating TC Chapter: North America
Task Force (TF) in which work is to be carried out: 3DP&I Bonded Wafer Stacks Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)

1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
Current wafer standards (SEMI M1) do not adequately address the needs of wafers used in bonded wafer stacks. Recently, the Bonded Wafer Stack TF has been developing SEMI Draft Document 5173, which originally covered six independent topics, of which one was spun out, balloted, and published as SEMI 3D2-0113.

The BWS TF has decided to split the remaining sections of 5173C into five separate documents. The outcome of this SNARF will be a document that addresses the needs for virgin silicon wafers for fabrication of circuits to be included in a 3D stack.

b. Estimate effect on industry.
2: Major effect on an industry sector - identify the relevant sector
Sector or Company Information: Memory, logic, MEMS

c. Estimate technical difficulty of the activity.
III: Difficult - Limited expertise and resources exist and/or achieving consensus is difficult

2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
This standard will provide guidelines for the purchase of 300 mm silicon wafers for use as device wafers in 3DS-IC application by appropriate entries for the wafer ordering table in SEMI M1.

b: Expected result of activity
New Standard or Safety Guideline (including replacement of an existing Standard or Safety Guideline)

For a new Subordinate Standard, identify the Primary Standard here:

For Standards, identify the Standard Subtype below:

Miscellaneous (describe below):

3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 03/29/2011b. 1st Draft by: 12/01/2014
c. (Optional) Informational Ballot by: d. Letter Ballot by: 02/14/2014
e. TC Chapter Approval By:04/01/2014

4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
List global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters as needed.)
Silicon Wafer

Intercommittee Ballots will be issued: Silicon Wafer, Packaging

b. Intercommittee Ballots:

Identify the recipient global technical committee(s):

5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

6. Intellectual Property Considerations:
a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:

If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:

b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):

c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:

NOTE FOR "the use of patented technology or a copyrighted item(s) is NOT required": If in the course of developing the document, it is determined that patented technology or copyrighted item(s) must be used to comply with the standard or safety guideline, the provisions of Section 16 of the Regulations must be followed.)

NOTE FOR "will include reproduced copyrighted material": A copyright release letter must be obtained from the copyright owner.

7. Comments, Special Circumstances:
5173 SNARF revised in late 2013, approved via 3DS-IC in February 10, 2014. 5173 was split into 5 more manageable activities.

5173 SNARF was granted one-year extension in Spring meeting 2015
5173 SNARF was granted an additional one-year extension in Spring meeting 2016

Proposal to transform 3DS-IC and Assembly & Packaging Committees into a single, unified global technical committee (GTC) was approved at the International Standards Committee meeting held on July 13, 2017 during SEMICON West.

Proposal Details:
To transform the 3DS-IC GTC and the Assembly & Packaging GTC into a Unified GTC
To name the transformed GTCs as "3D Packaging and Integration" GTC
Each TC chapter of the unified GTC will inherit the co-chairs of the existing TC chapters

All records were moved to the new 3D Packaging and Integration GTC.

8. TC Member Review:

Member Review Start Date; None.
Member Review End Date: None.

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (See Regulations 8.2.1)
9.. SNARF Approval Dates:
TC Chapter or GCS03/29/2011
Recorded in TC Minutes03/29/2011
Attach Pictures and Files here: