SEMI International Standards
Standards New Activity Report Form (SNARF)
Revised (if Applicable):
New Standard, Guide for Describing Silicon Wafers for Use in a 300 mm 3DS-IC Wafer Stack
Originating Global Technical Committee:
3D Packaging and Integration
Originating TC Chapter:
Task Force (TF) in which work is to be carried out:
3DP&I Bonded Wafer Stacks Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
Current wafer standards (SEMI M1) do not adequately address the needs of wafers used in bonded wafer stacks. Recently, the Bonded Wafer Stack TF has been developing SEMI Draft Document 5173, which originally covered six independent topics, of which one was spun out, balloted, and published as SEMI 3D2-0113.
The BWS TF has decided to split the remaining sections of 5173C into five separate documents. The outcome of this SNARF will be a document that addresses the needs for virgin silicon wafers for fabrication of circuits to be included in a 3D stack.
b. Estimate effect on industry.
2: Major effect on an industry sector - identify the relevant sector
Sector or Company Information:
Memory, logic, MEMS
c. Estimate technical difficulty of the activity.
III: Difficult - Limited expertise and resources exist and/or achieving consensus is difficult
Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
This standard will provide guidelines for the purchase of 300 mm silicon wafers for use as device wafers in 3DS-IC application by appropriate entries for the wafer ordering table in SEMI M1.
b: Expected result of activity
New Standard or Safety Guideline (including replacement of an existing Standard or Safety Guideline)
For a new Subordinate Standard, identify the Primary Standard here:
For Standards, identify the Standard Subtype below:
3. Projected Timetable for Completion:
a: General Milestones
a. Activity Start:
b. 1st Draft by:
c. (Optional) Informational Ballot by:
d. Letter Ballot by:
e. TC Chapter Approval By:
4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
List SEMI global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters and scopes as needed.)
Intercommittee Ballots will be issued: Silicon Wafer, Packaging
List any planned Type I Liaisons with external nonprofit organizations (e.g., SDO) that should receive Draft Documents from Standards staff for feedback during this activity and be notified when the Letter Ballot is issued (refer to Procedure Manual § 7):
Identify the recipient global technical committee(s):
5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline
to be a Safety Guideline
": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the
for special procedures to be followed.
NOT to be a Safety Guideline
": When all safety-related information is removed from the Document, the Document is still technically sound and complete.
6. Intellectual Property Considerations:
For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines
If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:
For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):
The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:
the use of patented technology or the incorporation of Copyrighted Item(s) is NOT required’
: If in the course of developing the Document, it is determined that the use of patented technology or Copyrighted Item(s) is necessary for the Document, the provisions of
§ 16 must be followed.
will incorporate Copyrighted Item’
: A copyright release letter must be obtained from the copyright owner prior to publication.
7. Comments, Special Circumstances:
5173 SNARF revised in late 2013, approved via 3DS-IC in February 10, 2014. 5173 was split into 5 more manageable activities.
5173 SNARF was granted one-year extension in Spring meeting 2015
5173 SNARF was granted an additional one-year extension in Spring meeting 2016
5173 SNARF was granted an additional one-year extension in Spring meeting 2017
Proposal to transform 3DS-IC and Assembly & Packaging Committees into a single, unified global technical committee (GTC) was approved at the International Standards Committee meeting held on July 13, 2017 during SEMICON West.
To transform the 3DS-IC GTC and the Assembly & Packaging GTC into a Unified GTC
To name the transformed GTCs as "3D Packaging and Integration" GTC
Each TC chapter of the unified GTC will inherit the co-chairs of the existing TC chapters
All records were moved to the new 3D Packaging and Integration GTC.
TC Member Review:
Member Review Start Date;
Member Review End Date:
‘TC Member Review’ is required by the
for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (Refer to
9. SNARF Approval Dates:
TC Chapter or GCS
Recorded in TC Minutes
10. SNARF Extension Dates:
TC Chapter Extension Granted on
Extension Expires on