Activity Number: 5441
SNARF for: Revision of SEMI M1, Specifications for Polished Single Crystal Silicon Wafers
SEMI International Standards
SEMI New Activity Report Form (SNARF)
1. Rationale: This revision is intended
|Originating Global Technical Committee: Silicon Wafer|
|Originating Technical Committee Region: North America|
|Task Force in which work is to be carried out: International Polished Wafers Task Force|
(1) to remove reference to the template method of verifying that parameter-based edge profiles are within the specification. This is because this method is not correct and is not currently being used in the industry. At the same time, to Appendix that describes how to construct the template is being replaced by a Related Information section that gives a procedure for drawing the edge-shape envelope of wafers with parameter-based edge profiles.
(2) to remove § 7(Basic Specification Without Optional Requirements. This 300 mm wafer specification was established for aiming the cost effective 300 mm silicon wafer for general use, about ten years ago. Actually, however, it is well known that these specification parameters are not appropriate for manufacturing the optimized device performance. On the other hand, separate standard documents regarding 300 mm monitor wafers and test wafers for production line control had been established. And also, Specification Guides for Advanced Technology Generations including 300 mm wafers were incorporated a half year ago. These are continuous and consistent revisions.
Rate the Estimated Effect on the Industry
4: Slight effect or effect not determinable
Rate the Estimated Technical Difficulty of the Activity
I: No Difficulty - Proven concepts and techniques exist or quick agreement anticipated
a: Define the areas to be covered or addressed by this activity or document:
b: Expected result of activity
Revision to an existing Standard/Guideline
3. Projected Timetable for Completion:
|a: General Milestones|
|a. Activity Start: 07/01/2012||b. 1st Draft by: 07/01/2012|
|c. Preballot by: ||d. Technical Ballot by: 08/01/2012|
|e. Committee Approval By:12/01/2012|
The resulting document is expected NOT to be a Safety Guideline
Intellectual Property Considerations:
a. In complying with the standard or safety guideline to be developed, the use of patented technology or a copyrighted item(s) is NOT required
b. The body of the standard and any appendices or related information sections will NOT include copyrighted material
Comments, Special Circumstances: None.
Approval: Activity approved by Committee/GCS on July 10, 2012
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