SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 01/20/2015Revised (if Applicable): 08/04/2015

Document Number: 5836
SNARF for: New Standard: Test Method for Adhesive Strength for Adhesive Tray Used for Thin Chip Handling

Originating Global Technical Committee: 3D Packaging and Integration
Originating TC Chapter: Japan
Task Force (TF) in which work is to be carried out: Thin Chip Handling Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)

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1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
The thickness of a chip is thinner as the number of production of 3Ds-IC increases. As a result, many kinds of transportation containers are used. Because the stability of transporting the chip and the flexibility of chip storage are high in those transportation containers, the adhesive tray is advantageous. However, the method of quantitatively measuring the adhesive strength of a thin chip on the adhesive type tray is not clear.
Therefore, the convenience of the users will be improved by deciding quantitative measurement method. This standardization defines the method of measuring adhesive strength and helps show the adhesive strength index.
And, it contributes to the easiness of the adhesive tray selection and the improvement of supply chain.


b. Estimate effect on industry.
1: Major effect on entire industry or on multiple important industry sectors - identify the relevant sectors
Sector or Company Information:

c. Estimate technical difficulty of the activity.
I: No Difficulty - Proven concepts and techniques exist or quick agreement is anticipated

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2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
The standards for the method of measuring the adhesive strength of the adhesive tray will be defined as follows.
(1)Measuring system (System configuration, die pick up tool)
(2)Test method (die mount layout, measurement environment, peeling speed, etc.)

b: Expected result of activity
New Standard or Safety Guideline (including replacement of an existing Standard or Safety Guideline)

For a new Subordinate Standard, identify the Primary Standard here:




For Standards, identify the Standard Subtype below:
Test Method

Miscellaneous (describe below):

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3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 04/30/2014b. 1st Draft by: 03/31/2015
c. (Optional) Informational Ballot by: d. Letter Ballot by: 05/31/2015
e. TC Chapter Approval By:09/30/2015

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4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
a. List SEMI global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters and scopes as needed.)
3DS-IC North America TC , Taiwan TC

b. List any planned Type I Liaisons with external nonprofit organizations (e.g., SDO) that should receive Draft Documents from Standards staff for feedback during this activity and be notified when the Letter Ballot is issued (refer to Procedure Manual § 7):


c. Intercommittee Ballots:
will be issued – identify the recipient global technical committee(s):

Identify the recipient global technical committee(s):

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5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

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6. Intellectual Property Considerations:
Note: Both a: and b: below should be checked for Revision of existing Standard(s) and Safety Guideline(s).

a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:
the use of patented technology is NOT required.

If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:


b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):
there is no known material patented technology necessary to use or implement the Standard(s) and Safety Guideline(s)

c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:
will NOT include reproduced copyrighted material



NOTE FOR ‘the use of patented technology or the incorporation of Copyrighted Item(s) is NOT required’: If in the course of developing the Document, it is determined that the use of patented technology or Copyrighted Item(s) is necessary for the Document, the provisions of Regulations § 16 must be followed.

NOTE FOR ’will incorporate Copyrighted Item’: A copyright release letter must be obtained from the copyright owner prior to publication.

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7. Comments, Special Circumstances:
The first version of the SNARF was approved on Feb 2015.

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Proposal to transform 3DS-IC and Assembly & Packaging Committees into a single, unified global technical committee (GTC) was approved at the International Standards Committee meeting held on July 13, 2017 during SEMICON West.

Proposal Details:
To transform the 3DS-IC GTC and the Assembly & Packaging GTC into a Unified GTC
To name the transformed GTCs as "3D Packaging and Integration" GTC
Each TC chapter of the unified GTC will inherit the co-chairs of the existing TC chapters

All records were moved to the new 3D Packaging and Integration GTC.
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8. TC Member Review:
took place between (put dates below) before approval by the GCS, or

Member Review Start Date; 1/30/2015
Member Review End Date: 2/12/2015

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (Refer to Regulations ¶ 8.2.1)
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9. SNARF Approval Dates:
TC Chapter or GCS01/20/2015
Recorded in TC Minutes

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10. SNARF Extension Dates:
TC Chapter Extension Granted on
Extension Expires on