SEMI International Standards
Standards New Activity Report Form (SNARF)
Revised (if Applicable):
New Standard - Specification for Single Device Traceability for the Supply Chain
Originating Global Technical Committee:
Originating TC Chapter:
Task Force (TF) in which work is to be carried out:
Single Device Traceability Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
A unique Electronic Chip ID (ECID), also known as a device ID, in silicon devices has been implemented in individual die/designs for over two decades. This identifier has been traditionally used by the silicon designers and manufacturers to trace die through the silicon manufacturing flow to aid the enhancement of silicon fab yields. An additional benefit of this ID is to be able to trace individual die and packaged parts through their final application testing in the final product before shipping to a customer. The ID can also be used to trace parts that subsequently fail in the field.
The recent evolution of data analytics is now allowing, via the device ID, end to end data analysis of single dies’ performances from initial wafer test to the product level test and field performance. Analysis of a device’s data in its native mode compared to its initial wafer or package (final test) testing data, now allows further in-depth yield learning. Silicon device fail data from failing die during the product manufacturing test (that forms the device’s DPPM [defective parts per million]), can be correlated back to the wafer and final test manufacturing test data to find new issues (e.g., silicon test coverage gaps and systematic and random defects found only during product level or system level test). Adding device ID to a component provides an extended opportunity to improve product quality and reduce DPPMs. Further, if a field recall is needed, individual faulty parts can be traced, thus greatly reducing the size of a recall, where all parts may have to be recalled if no device ID were present.
Device designers, manufacturers and suppliers that do not implement device IDs in their devices will be missing out on this opportunity to reduce DPPM. Many applications, like networking, medical and automotive are requiring the lowest possible DPPMs (trending to zero). Device ID for end to end traceability is one way to enable this continued quest for highest quality.
The resulting activity will establish a standardized approach for enabling traceable device-level identification (ID) throughout the IC manufacturing, test, and assembly processes to the point of use in the final system. Suppliers and board-level manufacturers can use this unique identifier to communicate about a specific device for the purposes of performance or failure analysis. The unique identifier will enable the ability to send manufacturing data back and forward through the supply chain to perform data analysis.
b. Estimate effect on industry.
1: Major effect on entire industry or on multiple important industry sectors - identify the relevant sectors
Sector or Company Information:
materials suppliers, device designers, device makers, board manufacturers, and system integrators from various industry sectors such as semiconductor, automotive, and medical
c. Estimate technical difficulty of the activity.
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible
Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
The resulting Document will establish a model focusing on the minimum of key concepts, behaviors, and requirements for enabling device ID and traceability. The standard is intended for implementation by materials suppliers, device designers, device makers, board manufacturers, and system integrators from various industry sectors such as semiconductor, automotive, and medical. This standard applies to different device configurations ranging from single integrated circuits to multi-chip/3D structures. This standard can be adapted for use with a range of technologies, ranging from legacy systems to the latest in electronic chip identification (ECID) and 2D code package marking. This standard defines, at a high level, the minimum requirements for device ID and traceability for new design and manufacturing implementation as well as for backwards compatibility with existing methods.
b: Expected result of activity
New Standard or Safety Guideline (including replacement of an existing Standard or Safety Guideline)
For a new Subordinate Standard, identify the Primary Standard here:
For Standards, identify the Standard Subtype below:
3. Projected Timetable for Completion:
a: General Milestones
a. Activity Start:
b. 1st Draft by:
c. (Optional) Informational Ballot by:
d. Letter Ballot by:
e. TC Chapter Approval By:
4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
List SEMI global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters as needed.)
List any planned Type I Liaisons with external nonprofit organizations (e.g., SDO) that should receive Draft Documents from Standards staff for feedback during this activity and be notified when the Letter Ballot is issued (see Procedure Manual § 7):
will be issued – identify the recipient global technical committee(s):
Identify the recipient global technical committee(s):
Automated Test Equipment
5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline
to be a Safety Guideline
": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the
for special procedures to be followed.
NOT to be a Safety Guideline
": When all safety-related information is removed from the Document, the Document is still technically sound and complete.
6. Intellectual Property Considerations:
For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines
the use of patented technology is NOT required.
If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:
For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):
there is no known material patented technology necessary to use or implement the Standard(s) and Safety Guideline(s)
The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:
will NOT include reproduced copyrighted material
the use of patented technology or the incorporation of Copyrighted Item(s) is NOT required’
: If in the course of developing the Document, it is determined that the use of patented technology or Copyrighted Item(s) is necessary for the Document, the provisions of
§ 16 must be followed.
will incorporate Copyrighted Item’
: A copyright release letter must be obtained from the copyright owner prior to publication.
7. Comments, Special Circumstances:
TC Member Review:
took place between (put dates below) before approval by the GCS, or
Member Review Start Date;
Member Review End Date:
‘TC Member Review’ is required by the
for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (See
9. SNARF Approval Dates:
TC Chapter or GCS
Recorded in TC Minutes
10. SNARF Extension Dates:
TC Chapter Extension Granted on
Extension Expires on
Attach Pictures and Files here: