SEMI International Standards
SEMI New Activity Report Form (SNARF)



Activity Number: 4965
SNARF for: New Standard: Mechanical Interface Specification for 450 mm Load Port for Tape Frame Cassettes in The Backend Process


Originating Global Technical Committee: Assembly & Packaging
Originating Technical Committee Region: Japan
Task Force in which work is to be carried out: JA 450mm Assembly and Test Die Preparation Task Force


1. Rationale: Equipment suppliers and IC makers have identified a need to develop standards for die prep factory interfaces to support 450mm equipment development and prototyping.
Rate the Estimated Effect on the Industry
3: Major effect on a few companies - identify the relevant companies

Rate the Estimated Technical Difficulty of the Activity
III: Difficult - Limited expertise and resources exist and/or achieving consensus difficult

2. Scope:
a: Define the areas to be covered or addressed by this activity or document:
Standardize the dicing process, die bonding process and the load port specification of the cassette forφ450 mm frame(used for shipping)

1.The frame cassette of manufacturing unit and the mechanical interface
2.Mechanical interface with manufacturing unit and handling device such as PGV
3.Other


b: Expected result of activity
New Standard

3. Projected Timetable for Completion:
a: General Milestones
a. Activity Start: 03/12/2010b. 1st Draft by: 06/01/2010
c. Preballot by: d. Technical Ballot by: 11/01/2010
e. Committee Approval By:01/10/2011




Safety Considerations:
The resulting document is expected NOT to be a Safety Guideline


Intellectual Property Considerations:
a. In complying with the standard or safety guideline to be developed, the use of patented technology or a copyrighted item(s) is NOT required
b. The body of the standard and any appendices or related information sections will NOT include copyrighted material

Comments, Special Circumstances: None.

Approval: Activity approved by Committee/GCS on April 9, 2010