Activity Number: 4981
SNARF for: Revision to SEMI E158-0710, Mechanical Specification for Fab Wafer Carrier Used to Transport and Store 450mm Wafers (FOUP) and Kinematic Coupling
SEMI International Standards
SEMI New Activity Report Form (SNARF)
1. Rationale: The 450mm FOUP standard was approved by the NA PIC Committee in November 2009 and it is currently in the publication process by SEMI pending IP Letter Of Assurance (LOA) from two IP holders. The TF plan is to update this document, once it is published, to align it with the latest MAC design to enable compatibility and interoperability, as well as correct some errors that were discovered. This SNARF is to get the process started while TF waits for LOA closure by SEMI.
|Originating Global Technical Committee: Physical Interfaces & Carriers|
|Originating Technical Committee Region: North America|
|Task Force in which work is to be carried out: International 450 mm Physical Interfaces & Carriers|
Now the 450 NA Shipping Box TF has closed the design for the 450mm Multi Application Carrier (MAC) and the 450 International Shipping Box TF has close on the architecture design (including envelope) and is in the process of closing the remaining design parameters, the TF needs to get the 450 FOUP document updated. Both 450 MAC and 450 FOSB will have a yellow ballot for Cycle 4, 2010.
The 450 FOUP changes will be balloted as a line items per agreement by TF. This ballot needs to be submitted for Cycle 4, 2010 as well.
The 450 FOUP Yellow Ballot submission was approved the NA PIC Committee in the March 2010 SEMI Spring Meeting pending LOA closure by SEMI.
Rate the Estimated Effect on the Industry
4: Slight effect or effect not determinable
Rate the Estimated Technical Difficulty of the Activity
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible
a: Define the areas to be covered or addressed by this activity or document:
1. Correct errors in document per agreement in TF
2. Update design to get it aligned with the 450mm MAC design per agreement in TF
Note: No change to the 450 FOUP wafer pitch.
b: Expected result of activity
Revision to an existing Standard/Guideline
3. Projected Timetable for Completion:
|a: General Milestones|
|a. Activity Start: 04/15/2010||b. 1st Draft by: 05/15/2010|
|c. Preballot by: ||d. Technical Ballot by: 05/15/2010|
|e. Committee Approval By:07/16/2010|
The resulting document is expected NOT to be a Safety Guideline
Intellectual Property Considerations:
a. In complying with the standard or safety guideline to be developed, the use of patented technology or a copyrighted item(s) is NOT required
b. The body of the standard and any appendices or related information sections will NOT include copyrighted material
Comments, Special Circumstances: Intellectual Property Considerations:
Patent and/or patent applications material to this Standards draft document is unknown. Once the task force has determined that there is no alternative to the use of patented technology or copyrighted item(s), this SNARF will be revised then reapproved by the committee and the Global Coordinating Subcommittee (GCS).
Approval: Activity approved by Committee/GCS on May 17, 2010
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