SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 07/09/2012Revised (if Applicable): 10/12/2012

Document Number: 5450
SNARF for: Revision to SEMI M49-0912, Guide for Specifying Geometry Measurement Systems for Silicon Wafers for the 130 nm to 22 nm Technology Generations with Title Change to: Guide for Specifying Geometry Measurement Systems for Silicon Wafers for the 130 nm to 16 nm Technology Generations

Originating Global Technical Committee: Silicon Wafer
Originating TC Chapter: Japan
Task Force (TF) in which work is to be carried out: International Advanced Wafer Geometry Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)

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1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)
Along with progress for further wafer fabrication technology, the market needs to add the data for advanced technology. The current SEMI Standard M49 defines up to 22nm technical generation and need to add next generation technology of 16nm. The market already have consensus HVM of next generation will be started within several years.


b. Estimate effect on industry.
1: Major effect on entire industry or on multiple important industry sectors
Sector or Company Information:

c. Estimate technical difficulty of the activity.
I: No Difficulty - Proven concepts and techniques exist or quick agreement anticipated

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2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:
This revision includes all necessary parameter data to be applied to requirements of 16nm technical generation
- Title change to “GUIDE FOR SPECIFYING GEOMETRY MEASUREMENT SYSTEMS FOR SILICON WAFERS FOR THE 130 nm TO 16 nm”
- Add Level3 Variability, Matching Tolerance and Bias for 16nm technology generation in Table 4 also add 16nm Scaling models in Table A!-2
- Change 200mm usage for 32nm and 22nm Technical generation at Table 4.1.1
- Change 450mm usage for 130nm, 90nm, 65nm and 45nm Technical generation at Table 3.1.3 and Table 4.1.3
- Add SEMI M80 in 3.1 SEMI Standards and Table 1-1.7 Type of Cassettes as references.
- Clean up erroneous items and add information at Reference Wafer Properties in table 3, 4 and 5.


b: Expected result of activity
Revision to an existing Standard/Guideline

For a new Subordinate Standard, identify the Primary Standard here:




For Standards, identify the Standard Subtype below:


Miscellaneous (describe below):

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3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 07/01/2012b. 1st Draft by: 07/01/2012
c. (Optional) Informational Ballot by: d. Letter Ballot by: 10/01/2012
e. TC Chapter Approval By:12/01/2012

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4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
a.
List global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters as needed.)
None

b. Intercommittee Ballots:


Identify the recipient global technical committee(s):

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5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 14.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

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6. Intellectual Property Considerations:
a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:
the use of patented technology or a copyrighted item(s) is NOT required

If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:


b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):


c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:
will NOT include copyrighted material



NOTE FOR "the use of patented technology or a copyrighted item(s) is NOT required": If in the course of developing the document, it is determined that patented technology or copyrighted item(s) must be used to comply with the standard or safety guideline, the provisions of Section 15 of the Regulations must be followed.)

NOTE FOR "will include reproduced copyrighted material": A copyright release letter must be obtained from the copyright owner.

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7. Comments, Special Circumstances:
None.

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8. TC Member Review:
None.

Member Review Start Date; None.
Member Review End Date: None.

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (See Regulations 8.2.1)
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9.. SNARF Approval Dates:
TC Chapter or GCS07/10/2012
Recorded in TC Minutes
Attach Pictures and Files here: