SEMI International Standards
SEMI New Activity Report Form (SNARF)



Activity Number: 5270
SNARF for: New Standard: Guide for Measuring Voids in Bonded Wafer Stacks


Originating Global Technical Committee: 3DS-IC
Originating Technical Committee Region: North America
Task Force in which work is to be carried out: 3DS-IC Inspection and Metrology


1. Rationale: This Guide will assist the user in selection and use of bond-void metrology tools based on their application and a protocol for performing bond-void measurements. New bonding processes and applications are sensitive to significantly smaller voids than bonding processes currently used for 3DS-IC package sealing. The Guide will compare detection, in bonded wafer pairs, of prefabricated voids in several oxide thicknesses, the void detection limits of a range of metrology tools and provide application recommendations. This activity will be executed in a planned 3DS-IC project at SEMATECH. The test results and analysis will create a fundamental study of oxide-bonded wafer pairs. Subsequently this study can assist producers and users of other wafer bonding processes to develop robust products and evaluations.
Rate the Estimated Effect on the Industry
1: Major effect on entire industry or on multiple important industry sectors

Rate the Estimated Technical Difficulty of the Activity
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible

2. Scope:
a: Define the areas to be covered or addressed by this activity or document:
A number of technologies have been released to measure voids between bonded wafers. These technologies each have unique strengths and weaknesses. In this activity, we will compare the capabilities of these technologies and prepare a guide to the use and applicability of these tools for different bonding applications.

b: Expected result of activity
New Standard

3. Projected Timetable for Completion:
a: General Milestones
a. Activity Start: 07/01/2011b. 1st Draft by: 09/15/2011
c. Preballot by: d. Technical Ballot by: 01/15/2012
e. Committee Approval By:03/01/2012




Safety Considerations:
The resulting document is expected NOT to be a Safety Guideline


Intellectual Property Considerations:
a. In complying with the standard or safety guideline to be developed, the use of patented technology or a copyrighted item(s) is NOT required
b. The body of the standard and any appendices or related information sections will NOT include copyrighted material

Comments, Special Circumstances: None.

Approval: Activity approved by Committee/GCS on July 12, 2011