SEMI International Standards
Standards New Activity Report Form (SNARF)
Date Prepared: 07/11/2023Revised (if Applicable):

Document Number: 7150
SNARF for: New Standard: Guide to MEMS Manufacturing Readiness Levels

Originating Global Technical Committee: MEMS / NEMS
Originating TC Chapter: North America
Task Force (TF) in which work is to be carried out: MEMS Reliability Task Force
Note: If a new task force is needed, also submit a task force organization form (TFOF)

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1. Rationale:
a. Describe the need or problem addressed by this activity.
(Indicate the customer, what benefits they will receive, and if possible, quantify the impact on the return on investment [ROI] if the Document is implemented.)

Guide for new MEMS device development from lab to fab.

The MEMS Manufacturing Readiness Levels (MMRL) document has been developed to provide a series of best practices in the development and productization of Micro-Electromechanical-Systems (MEMS). The goal is to have common documented processes and practices that allow the creation of MEMS products that meet targeted specification, performance, quality, cost, time to market, etc.



b. Estimate effect on industry.
2: Major effect on an industry sector - identify the relevant sector
Sector or Company Information: MEMS Industry

c. Estimate technical difficulty of the activity.
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible

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2. Scope:
a: Describe the technical areas to be covered or addressed by this Document development activity. For Subordinate Standards, list common concepts or criteria that the Subordinate Standard inherits from the Primary Standard, as well as differences from the Primary Standard:

This document provides a guide to help companies assess and progress their readiness for manufacturing a MEMS product. The transition from basic research to mass production is broken down into 8 levels, similar to the Technology Readiness Levels (TRL) first developed by NASA. In this guide, each of the 8 levels has a section that:
• Describes the level
• Discusses the challenges at that level
• Presents the activities and tools used to progress through that level
• Provides exit criteria that should be accomplished before moving to the next level

While a large variety of MEMS products, processes, and technologies exist, this guide provides tools and best practices that should be applicable to most scenarios, providing a solid foundation on which to build a product specific stage-gate transition to mass production.


b: Expected result of activity
New Standard or Safety Guideline (including replacement of an existing Standard or Safety Guideline)

For a new Subordinate Standard, identify the Primary Standard here:




For Standards, identify the Standard Subtype below:
Guide

Miscellaneous (describe below):

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3. Projected Timetable for Completion:

a: General Milestones
a. Activity Start: 07/11/2023b. 1st Draft by: 11/06/2023
c. (Optional) Informational Ballot by: d. Letter Ballot by: 05/01/2024
e. TC Chapter Approval By:07/01/2024

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4. Liaisons with other Global Technical Committees/TC Chapters/Subcommittees/TFs:
a. List SEMI global technical committees, TC Chapters, subcommittees, or task forces in your or other Regions/Locales that should be kept informed regarding the progress of this activity. (Refer to SEMI Standards organization charts and global technical committee charters and scopes as needed.)


b. List any planned Type I Liaisons with external nonprofit organizations (e.g., SDO) that should receive Draft Documents from Standards staff for feedback during this activity and be notified when the Letter Ballot is issued (refer to Procedure Manual § 7):


c. Intercommittee Ballots:
will be issued – identify the recipient global technical committee(s):

Identify the recipient global technical committee(s):
3D Packaging and Integration, Silicon Wafer
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5. Safety Considerations:
The resulting document is expected:
NOT to be a Safety Guideline

NOTE FOR "to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is NOT technically sound and complete - Refer to Section 15.1 of the Regulations for special procedures to be followed.

NOTE FOR "NOT to be a Safety Guideline": When all safety-related information is removed from the Document, the Document is still technically sound and complete.

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6. Intellectual Property Considerations:
Note: Both a: and b: below should be checked for Revision of existing Standard(s) and Safety Guideline(s).

a. For a new Standard or Safety Guideline and for any part to be modified or added in a Revision of published Standards and Safety Guidelines:
the use of patented technology is NOT required.

If "patented technology is intended to be included in the proposed Standard(s) or Safety Guideline(s) " is selected above, then also check one:


b. For Revision, Reapproval, Reinstatement, or Withdrawal of existing Standard(s) and Safety Guideline(s):


c. The body of the Document and any Appendices, Complementary Files, Related Information sections, or Various Materials that may or may not be a part of the Document by reference:
the incorporation of Copyrighted Item will NOT be required



NOTE FOR ‘the use of patented technology or the incorporation of Copyrighted Item(s) is NOT required’: If in the course of developing the Document, it is determined that the use of patented technology or Copyrighted Item(s) is necessary for the Document, the provisions of Regulations § 16 must be followed.

NOTE FOR ’will incorporate Copyrighted Item’: A copyright release letter must be obtained from the copyright owner prior to publication.

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7. Comments, Special Circumstances:
In cooperation with SEMI MSIG Manufacturing Working Group.

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8. TC Member Review:
took place between (put dates below) before approval by the GCS, or

Member Review Start Date; 07/17/2023
Member Review End Date: 07/31/2023

NOTE FOR ‘TC Member Review’ is required by the Regulations for a period of at least two weeks
before approval of a new, or a major revision of an existing, Standard or Safety Guideline. (Refer to Regulations ¶ 8.2.1)
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9. SNARF Approval Dates:
TC Chapter or GCS08/14/2023
Recorded in TC Minutes

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10. SNARF Extension Dates:
TC Chapter Extension Granted on
Extension Expires on