SEMI International Standards
TASK FORCE ORGANIZATION FORM (TFOF)
Date Prepared:
03/30/2023
Revised (if Applicable):
Name of Task Force (TF):
Integrated Workflows in Failure Analysis Task Force
Global Technical Committee:
Physical Interfaces & Carriers
Originating Technical Committee Region:
North America
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1. Charter:
(State the objective of the proposed TF.)
Objective of the TF is to define a set of specifications for a sampler holder and applicable physical interface information (e.g., alignment marks) that can be used for a wide range of applications within failure analysis of semiconductor devices for different methods for failure localization, preparation, and imaging. The purpose of this process is to enable integrated workflows, where samples can be exchanged between various tools while staying on same sample holder that also includes alignment marks to find regions of interest in every tool of the workflow.
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2. Scope:
(Define the specific activities that the TF will conduct.)
Set mechanical specifications of universal sample holder to be used for sample exchange between equipment of different suppliers for failure analysis of semiconductor devices. Material discussions may also be included as application notes.
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3. Formal linkages with TFs in other Regions/Locales:
(Show each associated TF and its parent global technical committee; indicate nature of relationship – global TF, observer TF, etc.)
Global Information & Control TC (universal data header)
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4. Formation Date:
(TF formed on)
Task Force formed on:
11/08/2023
Task Force approved by Committee/GCS on:
11/08/2023
5. Comments
None.
