SEMI International Standards
SEMI New Activity Report Form (SNARF)

Activity Number: 4815
SNARF for: Specification for Tape Frame for 450 mm Wafer

Originating Global Technical Committee: Assembly & Packaging
Originating Technical Committee Region: Japan
Task Force in which work is to be carried out: JA 450mm Assembly and Test Die Preparation Task Force

1. Rationale: Equipment suppliers and IC makers have identified a need to develop standards for die prep factory interfaces to support 450mm equipment development and prototyping.
Rate the Estimated Effect on the Industry
2: Major effect on an industry sector - identify the relevant sector

Rate the Estimated Technical Difficulty of the Activity
III: Difficult - Limited expertise and resources exist and/or achieving consensus difficult

2. Scope:
a: Define the areas to be covered or addressed by this activity or document:
Develop specification for the tape frame used for dicing and die bonding processes and shipping. The specifications include:
Dimension of tape frame
Mechanical strength of tape frame (Modulus of elasticity, etc.)
Compatibility with dicing tapes
Mechanical interface with process equipment

b: Expected result of activity
New Standard

3. Projected Timetable for Completion:
a: General Milestones
a. Activity Start: 08/01/2009b. 1st Draft by: 01/01/2010
c. Preballot by: d. Technical Ballot by: 02/01/2010
e. Committee Approval By:03/01/2010

Safety Considerations:
The resulting document is expected NOT to be a Safety Guideline

Intellectual Property Considerations:
a. In complying with the standard or safety guideline to be developed, the use of patented technology or a copyrighted item(s) is NOT required
b. The body of the standard and any appendices or related information sections will NOT include copyrighted material

Comments, Special Circumstances: None.

Approval: Activity approved by Committee/GCS on September 18, 2009