SEMI International Standards
SEMI New Activity Report Form (SNARF)



Activity Number: 4588
SNARF for: New Standard: Guide for Specifying Edge Profile of 450 mm Silicon Wafers


Originating Global Technical Committee: Silicon Wafer
Originating Technical Committee Region: Japan
Task Force in which work is to be carried out: International Advanced Wafer Geometry Task Force


1. Rationale: The wafer edge profile template of M1 is too wide for practical use. A better-defined and more restrictive edge profile specification is needed for 450 mm wafer development. Further refinement of these specifications will be needed as 450 mm wafers and equipment are developed.
Rate the Estimated Effect on the Industry
2: Major effect on an industry sector - identify the relevant sector

Rate the Estimated Technical Difficulty of the Activity
II: Some Difficulty - Disagreements on known requirements exist but developing consensus is possible

2. Scope:
a: Define the areas to be covered or addressed by this activity or document:

This standard is limited to 450mm silicon wafer-related discussions, including mechanical wafer, test wafer, wafer carrier and wafer handling. This document will provide a guide to specifying edge profile for the discussion and development of 450 mm wafer-related standards


b: Expected result of activity
New Standard

3. Projected Timetable for Completion:
a: General Milestones
a. Activity Start: 04/10/2008b. 1st Draft by: 04/14/2008
c. Preballot by: d. Technical Ballot by: 07/20/2008
e. Committee Approval By:10/01/2008




Safety Considerations:
The resulting document is expected NOT to be a Safety Guideline


Intellectual Property Considerations:
a. In complying with the standard or safety guideline to be developed, the use of patented technology or a copyrighted item(s) is NOT required
b. The body of the standard and any appendices or related information sections will NOT include copyrighted material

Comments, Special Circumstances: None.

Approval: Activity approved by Committee/GCS on April 8, 2008